Embedded Computing Design

The partnership will offer multi-project-wafer (MPW) runs for the microelectronics community, integrating MOSIS manufacturing services with Intel?s high-performance device fabrication technology.

MVTec Software and Hilscher Gesellschaft f?r System automation initiated a technical partnership to enable easier integration of machine vision and process automation.

Here?s a slideshow of some of the interesting sights and people that were at PCIM 2019.

In this podcast we talk to Loic Moreau, EMEA Sales and Marketing Director for Danisense, who talks about the need for accuracy in power measurement.

X-FAB Silicon Foundries introduced SubstrateXtractor, presented as the first commercially-available tool dedicated to addressing the simulation of large-signal substrate parasitic effects.

Toshiba Electronics Europe added the M4G Group to its TXZ Family of ARM Cortex-M-based microcontrollers for office automation, audio-visual equipment, and industrial applications.

We talked to Pre-Switch CEO Bruce Renouard on the new platform, which enables power design engineers to investigate the company?s soft-switching architecture and platform.

Adesto Technologies, IBM, and NXP Semiconductors unveiled a solution that provides a new level of security for smart building and Industrial Internet of Things (IIoT) deployments.

Pentek introduced the Model 54851, a member of the Jade family of high-performance 3U VPX boards, based on the Xilinx Kintex Ultrascale FPGA.

Diodes Incorporated introduced the AL3353 LED/LCD 40V max input boost controller.

Plessey will showcase its latest microLED display solutions for AR/MR, HUD/HMDs, smartphones, and other display applications at Display Week 2019.

Industry's focus is shifting from the promise of Gallium Nitride (GaN) to the reality of the products enabled by it, with new packaging options available for emerging application spaces.

GaN Systems will demonstrate the 650 V, 150 A GaN power transistor, presented as the industry?s highest-current device of its type.

STMicroelectronics? HB2 650V IGBT series delivers efficiency and performance gains for medium- and high-speed applications.

Distrelec has added Digilent?s DMC60C Digital Motor Controller to their web shop for the research and education sector.

PCIM Asia Conference 2019 will promote the academic and industrial development of power electronics by assembling the latest research results from around the globe.

Heraeus Electronics announced that its Condura product line has been enhanced with features for Direct Copper Bonding (DCB) substrates.

At this year's PCIM trade fair, Infineon Technologies will present four new HybridPACK Drive modules, optimized for different inverter performance levels between 100 kW and 200 kW.

In this podcast we talk to Eric Thelen, the Director of EIT Digital, about how expansion into Silicon Valley will further strengthen Europe's innovation ecosystem.

Energy harvesting is not a new concept ? solar panels have been around for a long time. But recent advances in circuit efficiency have made quantum forms of energy harvesting viable.