Embedded Computing Design

XJTAG, a developer of JTAG boundary scan test solutions, released two new features that enhance the ease-of-use of boundary scan tools, such as the XJTAG 3.10.

The Industrial Internet Consortium (IIC) and the 5G Alliance for Connected Industries and Automation (5G-ACIA) will collaborate in an effort to maximize synergies of 5G for the Industrial Internet.

Rohde & Schwarz, along with CommSolid, a cellular IoT company, have developed tests and measurement equipment to show the effectiveness of NB-IoT devices.

IAR Systems released its newest version the functional safety edition of IAR Embedded Workbench for Renesas? RX Family of microcontrollers (MCUs).

ACM introduced its Ultra SFP ap tool for advanced packaging solutions. The tool was designed to address yield issues arising from through-silicon via (TSV) processes and fan-out wafer-level packaging.

u-blox announced its SARA-R410M-63B module has been certified for Japan market on the LTE-M cellular network of the domestic network operators.

Semtech announced its new LoRa-based platform, LoRa Edge, for the development of Internet of Things (IoT) applications.

The Khronos Group, an open consortium of companies creating advanced interoperability standards, announced the ratification and public release of the Vulkan Ray Tracing provisional extensions.

Toradex announced the launch of its newest family of System on Modules (SoM), Verdin. The first modules of the line feature the NXP i.MX 8M Mini/Nano applications processors.

SmartDV Technologies introduced its new Design IP for DDR5 and LPDDR5 SDRAM controllers.

Eta Compute announced it has made the first shipment of production silicon for its ECM3532, an AI multicore processor for embedded sensor applications.

MixComm announced its first production device, the SUMMIT 2629. The start-up?s technology is based upon breakthroughs developed at Columbia University CoSMIC lab led by Dr. Harish Krishnaswamy.

Infineon announced it will be releasing the IMC300 motor controller series. The series combines the iMOTION Motion Control Engine with an additional microcontroller based on the Arm Cortex-M0 core.

Seco has released the COM Express T7 DEV KIT, a Cross Platform Development Kit compatible with both x86 and Arm COM Express Type 7 modules.

N.A.T. has developed a Network in a Box System for Massive MIMO (MMIMO) networks and scalable phased antenna arrays, including multi-antenna transmission remote radio heads (RRH).

The PCI Industrial Computer Manufacturers Group (PICMG) announced it is completing the development of a new COM-HPC computer-on-module specification for the industrial edge computing market.

HEITEC presented HeiSys, an embedded system platform, at the embedded world trade conference in Nuremberg, Germany, in February.

CEVA announced Ambiq Micro has licensed CEVA?s RivieraWaves Bluetooth low energy IP for use in its next-generation Subthreshold Power-Optimized Technology (SPOT) platforms.

AAEON released the FWS-2275 a hardware solution to help solve issues of network security in industrial environments.

MEMXPRO, a DRAM module and SSD solution provider introduced its new generation of TLC SSDs with extra-long lifespan at embedded world.