The international embedded community is gathering again this year in Nuremberg, Germany, from June 21 to 23, for the embedded world Exhibition&Conference 2022. SECO has exhibited at the show since its beginning and looks forward to this year’s booth on the showroom floor for meeting with customers and partners, and also developing new connections.

The fifth visit on our road to embedded world is Arezzo, Italy, for a sneak peek at what SECO is planning for embedded world 2022.

SECO introduced JULIET, a COM Express Type 7 module based on Intel Xeon D-1700 processors (formerly Ice Lake-D). This announcement is simultaneous with Intel's release of this latest generation processor platform, for which SECO is an Intel Early Access Program partner.

COM-HPC was officially ratified about six months ago. Embedded Computing Design has done a nice job covering the spec and many of the products that have come out of the spec (some before ratification and many after). We also posted a series of videos (called COM-HPC Academy) with some of the influential members of PICMG, the standards body behind the spec.

SECO signed an agreement for the acquisition of Oro Networks, a US company based in the Silicon Valley.

Optimized for flexibility and reliability, SECO’s SM-C93 SMARC system on module (SOM) enables high levels of safety, which has become a critical challenge in many industries, without compromising high performance and providing rapid time-to-market.