Hello Embedded Professionals, Engineers, and Developers! Welcome to In Case You Missed it, the weekly news show all about Embedded technologies and solutions from Embedded Computing Design.

SECO announced early sample access for a limited quantity of its SOM-SMARC-Dragonwing-IQ8 hardware allowing the evaluation of the SMARC Rel. 2.1.1 module based on Dragonwing IQ8 Series. The module was engineered as part of the collaboration between SECO, Arduino, and Qualcomm Technologies, Inc. It enables users to move from rapid prototyping to production-oriented architectures for AI-enabled robotics, smart machines, industrial vision, HMI, and machine control.

Throughout embedded world Germany (March 10–12, Nuremberg), SECO will be in Hall 1 at Booth 320 where it will focus on its NXP Semiconductors-based solutions. The spotlight will be on SECO’s portfolio built on NXP applications processors, with an emphasis on the i.MX 95 Applications Processors Family.

In Hall 1, booth 320 at embedded world Germany (March 10-12, 2026), SECO will demonstrate its fully functioning smart vending/kiosk solution based on the Clea Vend cloud telemetry platform and the KarL4 contactless payment terminal enabling edge-to-cloud connectivity for meaningful insights through ongoing analysis of transactions and usage behavior.

Ken Briodagh is joined by Rodney Feldman, Product, Innovation, and Marketing VP, Seco USA at embedded world North America 2025.

SECO starts its road to embedded world at its global headquarters in Arezzo, Tuscany, Italy. Making its way to Anaheim by way of its US engineering and operations headquarters in Rockville, Maryland, SECO will host visitors to Booth 7011 at this years embedded world North America where it will showcase its end-to-end solutions ranging from next-generation edge computing hardware to its edge and cloud IoT software suite, Clea. SECO also has many demos showcasing its edge AI solutions.

Patrick Hopper interviews Maurizio Caporali with Seco at the Intel booth at embedded world 2025.