AAEON introduced its uCOM-IMX8P, an adaptable SMARC 2.1 compliant CPU module built on the NXP i.MX 8M Plus platform with an 82mm x 50mm SMARC form factor to utilize RISC architecture. The solution leverages the NXP i.MX 8M Plus’ Quad-Core Arm Cortex-A53 processor with an integrated NPU, an operating temperature range from -40°C ~ 85°C, and 4GB of onboard LPDDR4 memory and up to 128GB eMMC storage (default SKU: 16GB).

AAEON released the MXM-ACMA-PUC leveraging a range of 13th Generation Intel Core CPUs up to 35W, with the default processor being the 16 core, 24 thread Intel Core i7-13700TE. It includes an integrated MXM-ACMA module, offering either an embedded Intel Arc A370E or Intel Arc A350E GPU. The MXM-ACMA-PUC supports four LAN ports, (three running at 2.5GbE, and one at 1GbE), two USB 3.2 Gen 2, and two COM ports with RS-232/422/485 functionality.

AAEON's UP brand released the UP 710S, the next generation credit card sized single-board with adjusted height measuring at just 25.13mm. The solution’s size, when compared to previous models, does not reduce I/O options. The UP 710S upholds key features like GPIO, I2C, SPI, and COM that were possible via a 40-pin HAT through dedicated wafers.

AAEON Technology Inc. released the BOXER-8642AI, a fanless embedded AI computer featuring eight independent 10Gbps USB ports, leveraging a 32GB or 64GB NVIDIA Jetson AGX Orin module. It supports multiple Intel RealSense D405 3D cameras for high and wide bandwidth image processing for smart retail market applications such as AI-assisted self-checkout kiosks. Power input range is 12V to 24V with -25°C and 55°C operational temperature.

AAEON introduced the OMNI-ADP series, its Modular HMI Panel PCs including seven display sizes ranging from 10.4” to 21.5”. The family is powered by 12th Generation Intel Core processors. Across the series is an option of either PCAP and 5-wire resistive touchscreens, IP65 aluminum front bezel design, and both panel and VESA mounting options. Depending on the model, the OMNI-ADP PCs supports resolutions from 1024 x 768 - 1920 x 1080.

During embedded world North America, AAEON will exhibit its portfolio of pioneering AI solutions designed to bring embedded AI projects to realization. The main highlight of the booth will be a demonstration combining AAEON’s EPIC-RPS9 and MXM-ACMA. Visitors will witness the utilization of the 13th Generation Intel Core processing power of the EPIC-RPS9 with the MXM-ACMA’s Intel Arc GPU.

AAEON announced its collaboration with The Embedded Kit to offer a complete solution for the challenges facing industrial companies such as integration, maintenance, and cybersecurity. The partnership will provide a seamless and efficient design process by simplifying the complexities of software and hardware integration.