Hello Embedded Engineers, Developers and Makers! Welcome to In Case You Missed it: Embedded Insights, the weekly news show all about Embedded technologies and solutions from Embedded Computing Design.

AAEON introduced two new products to its desktop network appliance range, the FWS-2291 and FWS-2292, developed for SD-WAN, uCPE, and UTM applications. The additions leverage the Intel Processor N97 and Intel Processor N150, respectively. According to AAEON, both can support optional CPUs such as the Intel Atom x7000RE, Intel Atom x7000C, and Intel Processor N-series ranges (formerly Twin Lake, Alder Lake-N, and Amston Lake).

AAEON released the NanoCOM-MTU, a COM Express Type 10 CPU Module leveraging either the Intel Core Ultra 7 Processor 155H or Intel Core Ultra 5 Processor 125H, both 28W. The NanoCOM-MTU offers up to 16 cores and 22 threads in an 84mm x 55mm form factor.

AAEON and Qualcomm Technologies, Inc. are collaborating to speed up the implementation of innovative embedded IoT solutions enhancing medical, industrial automation, and transportation applications. The partnership utilizes AAEON's expertise in manufacturing and its early access capabilities to deliver customized market-ready solutions leveraging Qualcomm’s Dragonwing processors.

Ken Briodagh interviews Volkmar Kaufmann with AAEON at embedded world 2025.

AAEON released the EPIC-RPS7, a four-inch industrial single-board computer with support for 12th, 13th, and 14th Generation Intel Core Processors (up to 65W) and up to 64GB of DDR5 (4800/5200) using two SODIMM slots. The board was developed as an entry-level cost option for space constrained applications in smart manufacturing including industrial control, PLC automation, and remote monitoring.

AAEON's UP brand released two new developer boards based on the new Intel Core 3 processor platform (formerly Twin Lake). The UP Squared TWL and UP Squared Pro TW offers a choice of the Intel Core 3 Processor N355, Intel Processor N250, or Intel Processor N150 CPU.