Cadence
Tech News Roundup
ICYMI: Embedded Insights Ep26 072525 Memory IP, BLE, and AI Modules - Video
July 25, 2025Hello Embedded Engineers, Developers and Makers! Welcome to In Case You Missed it: Embedded Insights, the weekly news show all about Embedded technologies and solutions from Embedded Computing Design.
Cadence Powers AI Evolution with Advanced LPDDR6/5X Memory IP System Solution - News
July 18, 2025Cadence released its LPDDR6/5X memory IP system solution developed to function at 14.4Gbps, a 50 percent increase than prior LPDDR DRAM. The Cadence LPDDR6/5X memory IP system solution allows scaling of AI infrastructure to promote memory bandwidth, and volume demands of next-generation AI LLMs, agentic AI, and other process intense workloads for several verticals.
TSMC, Cadence, KLA, Siemens, and Synopsys Adopt NVIDIA Blackwell and CUDA-X Platforms - News
May 19, 2025TSMC, Cadence, KLA, Siemens, and Synopsys are advancing semiconductor manufacturing by adopting the NVIDIA CUDA-X and NVIDIA Blackwell platforms.
Synopsys, MediaTek, Marvell, and Others Embrace NVIDIA's NVLink Fusion for AI Workloads - News
May 19, 2025COMPUTEX—NVIDIA's NVIDIA NVLink Fusion, new silicon designed to enable the build of semi-custom AI infrastructure, has been adopted by MediaTek, Marvell, Alchip Technologies, Astera Labs, Synopsys, and Cadence, enabling custom silicon scale-up to support workloads for model training and agentic AI inference.
Cadence Bolsters IP Portfolio with Secure-IC Acquisition, Closing Expected in 2025 - News
January 27, 2025San Jose, California. Cadence has agreed to acquire Secure-IC enabling it to enhance Cadence’s range of innovative silicon-proven IP, including interface, memory, AI/ML, and DSP solutions. Boyd Phelps, senior vice president and general manager of the Silicon Solutions Group at Cadence commented, “We continue to invest in our comprehensive IP and design services portfolio to provide more complete system solutions for our customers.”



