HEITEC Releases HeiSys, Embedded System Platform
March 11, 2020
HEITEC presented HeiSys, an embedded system platform, at the embedded world trade conference in Nuremberg, Germany, in February.
HEITEC presented HeiSys, an embedded system platform, at the embedded world trade conference in Nuremberg, Germany, in February. The company designed its platform for high scalability and maximum flexibility in addition to being used a universal gateway, box PC or edge computer. HeiSys is certified for both medical and industrial applications. Furthermore, its certification makes it usable for mobile operations and in accordance to railway regulations.
HeiSys can be scaled to the required computing power based on FPGA modules. Engineers may have the ability to flexibly adapt the platform to the individual requirements of their target application and implement applications with intensive data processing quickly, according to the company.
A COM express board in combination with SMARC module-based FPGA boards can be chosen based on the complexity of the design and requirements for bandwidth, signal diversity, performance, and power consumption.
Full flexibility regarding wireless transmission technologies is guaranteed (per the company) via m.2 interfaces. The platform is designed for the use of WLAN, LTE, 5G, UMTS, GSM, LPWA, Bluetooth, GPS/GLONASS multiband radio modules for industrial data communication and railway applications.
Due to the absence of moving parts such as fans, the reliability as well as the MTBF are increased. The system operates in the temperature range between -40° - +85° C.
For more information, visit www.heitec-electronics.com.