CES 2025: DFI and DEEPX Pioneer Low-Power, High-Performance AI for Smart Cities
January 03, 2025
News
Taipei, Taiwan. DFI will collaborate with DEEPX at CES 2025 to reveal industrial edge AI solutions integrated with the DX-M1 AI accelerator for smart city applications. The cooperation between the two shows promise innovating on-device and application-specific AI, leading to a more flexible, efficient, and sustainable edge AI implementation.
The platforms integrate DFI’s industrial-grade hardware with the AI processing power of the DX-M1 delivering the capability to operate over 16 video channels on a single chip, achieve real-time processing at over 30 fps with GPU-level precision, and adequate power for up to 25 TOPs of AI performance with a reduction in power consumption.
Its ability to execute AI algorithms like object recognition and image classification simultaneously makes it a versatile solution for industrial robots, machine vision, AI-based IPC and HPC, smart factories, and other industries.
Visit DFI at the DEEPX booth (#9045) during CES 2025 (January 7–11) in the North Hall, Las Vegas Convention Center, where DFI will demonstrate two fanless embedded systems, the EC710-ASL and EC600-RPS, featuring the DEEPX DX-M1 M.2 AI accelerator. The solutions leverage Intel Atom and Intel 14th/13th/12th Gen processors, and support Intel Time Coordinated Computing (Intel TCC) technology for accurate real-time operations.
Ideal applications include critical real-time demands in smart cities such as enabling applications like smart transportation, surveillance, and accident prevention.
For more information, visit dfi.com.
Chad Cox. Production Editor, Embedded Computing Design, has responsibilities that include handling the news cycle, newsletters, social media, and advertising. Chad graduated from the University of Cincinnati with a B.A. in Cultural and Analytical Literature.
