Winbond Electronics

Winbond Electronics
Articles related to Winbond Electronics

Winbond’s Interoperability of OctalNAND Flash with Synopsys DesignWare AMBA IP Delivers Complete High-Density NAND Flash Solution - News

July 22, 2021

Flash optimizes data transfer rate with low latency for NAND with serial octal interface targeting automotive, mobile, and IoT SoCs


Winbond and Ambiq Enable Intelligent IoT and Wearables on Ultra-low Power - News

May 26, 2021

Winbond Electronics and Ambiq announced a collaboration to combine HyperRAM and Apollo4 to deliver ultra-low power system solutions for IoT endpoints and wearables.


The Hidden Security Risks of Automotive Electronic Systems - Story

May 12, 2021

The Internet of things (IoT) is driving new capabilities that are transforming how we live, work, and play.


Winbond Partners with Nuvoton, Qinglianyun to Release Fully Integrated Reference Design for OTA Firmware Updating - News

March 24, 2021

Winbond, in partnership with Nuvoton and Qinglianyun, released a fully integrated reference design for secure OTA firmware updating of IoT devices.


High-Performance, Low-Power DRAM Combines with SoC in a SiP - News

February 08, 2021

What do you get when you cross high-bandwidth memory with artificial intelligence (AI)?


Gowin Semiconductor Embeds 64Mb HyperRAM DRAM from Winbond for AI Edge Computing Solution - News

January 18, 2021

Winbond Electronics announced that FPGA manufacturer Gowin Semiconductor has embedded a Winbond 64Mb HyperRAM fast memory device in its new GoAI 2.0 machine learning platform. 


New Generation of Wearable Medical Devices Require Secure, High-Density Non-Volatile Memory - Story

September 28, 2020

The risk to connected, wearable devices is real. Official bodies such as the US Food and Drug Administration (FDA) have issued a stream of warnings to device users and manufacturers about known risks.