Winbond’s Interoperability of OctalNAND Flash with Synopsys DesignWare AMBA IP Delivers Complete High-Density NAND Flash Solution - NewsJuly 22, 2021
Flash optimizes data transfer rate with low latency for NAND with serial octal interface targeting automotive, mobile, and IoT SoCs
Winbond Electronics and Ambiq announced a collaboration to combine HyperRAM and Apollo4 to deliver ultra-low power system solutions for IoT endpoints and wearables.
The Internet of things (IoT) is driving new capabilities that are transforming how we live, work, and play.
Winbond Partners with Nuvoton, Qinglianyun to Release Fully Integrated Reference Design for OTA Firmware Updating - NewsMarch 24, 2021
Winbond, in partnership with Nuvoton and Qinglianyun, released a fully integrated reference design for secure OTA firmware updating of IoT devices.
What do you get when you cross high-bandwidth memory with artificial intelligence (AI)?
Winbond Electronics announced that FPGA manufacturer Gowin Semiconductor has embedded a Winbond 64Mb HyperRAM fast memory device in its new GoAI 2.0 machine learning platform.
The risk to connected, wearable devices is real. Official bodies such as the US Food and Drug Administration (FDA) have issued a stream of warnings to device users and manufacturers about known risks.