Winbond Electronics
Embedded Executive: Johnson Chen, Executive, Winbond - News
September 08, 2021The global chip shortage continues to rage on, and it appears to be worsening rather than getting better.
Winbond TrustME W77Q Secure Flash Obtains Common Criteria EAL2 and ISO 26262 ASIL-C Ready Certifications - News
August 11, 2021Winbond announced that the company's TrustME W77Q Secure Flash has obtained Common Criteria EAL2 and ISO 26262 ASIL-C Ready certifications from SGS Brightsight and SGS-TÜV Saar GmbH, respectively.
Winbond’s Interoperability of OctalNAND Flash with Synopsys DesignWare AMBA IP Delivers Complete High-Density NAND Flash Solution - News
July 22, 2021Flash optimizes data transfer rate with low latency for NAND with serial octal interface targeting automotive, mobile, and IoT SoCs
Winbond and Ambiq Enable Intelligent IoT and Wearables on Ultra-low Power - News
May 26, 2021Winbond Electronics and Ambiq announced a collaboration to combine HyperRAM and Apollo4 to deliver ultra-low power system solutions for IoT endpoints and wearables.
The Hidden Security Risks of Automotive Electronic Systems - Story
May 12, 2021The Internet of things (IoT) is driving new capabilities that are transforming how we live, work, and play.
Winbond Partners with Nuvoton, Qinglianyun to Release Fully Integrated Reference Design for OTA Firmware Updating - News
March 24, 2021Winbond, in partnership with Nuvoton and Qinglianyun, released a fully integrated reference design for secure OTA firmware updating of IoT devices.
High-Performance, Low-Power DRAM Combines with SoC in a SiP - News
February 08, 2021What do you get when you cross high-bandwidth memory with artificial intelligence (AI)?