Taipei, Taiwan. At COMPUTEX 2025, DFI and DEEPX highlighted the newest innovations that came to fruition from its edge AI partnership. The showcase featured embedded platforms leveraging DEEPX AI chips ideal for applications in smart cities and smart manufacturing. The main highlight was the integration of the DEEPX M.2 AI chip into DFI's enhanced AI solutions based on the EC700 and EC600 series platforms. The EC600 series supports an optional GPU for higher computing requirements.

Taipei, Taiwan. DFI will collaborate with DEEPX at CES 2025 to reveal industrial edge AI solutions integrated with the DX-M1 AI accelerator for smart city applications. The cooperation between the two shows promise innovating on-device and application-specific AI, leading to a more flexible, efficient, and sustainable edge AI implementation.

DEEPX plans to develop its first-generation AI chip portfolio to concentrate intelligent video analytics and security system market. DEEPX plans an exhibition at COMPUTEX 2024 where it will demonstrate the acceleration of its on-device AI solutions.

During Computex 2023, DEEPX will exhibit its AI chip solutions and edge AI technologies. CEO Lokwon Kim said, "I founded DEEPX to have fundamental AI semiconductor technology developed in my country and have been successful in developing AI semiconductor products that can be recognized in the global market."