Renesas Electronics and SiFive, Inc. announced a strategic partnership to jointly develop next-generation, high-end RISC-V solutions for automotive applications. The partnership will also include SiFive licensing the use of their RISC-V core IP portfolio to Renesas.

Renesas Electronics announced the RZ/Five general-purpose microprocessor units (MPUs) built around a 64-bit RISC-V CPU core.

A large number of electronic systems in modern vehicles are networked with one another. Because these systems are vulnerable to cyber attacks, Fraunhofer IPMS created a CANsec IP core to improve the security of vehicle systems.

Renesas Electronics Corporation announced the development of circuit technologies for a 22-nm embedded spin-transfer torque magnetoresistive random-access memory (STT-MRAM, hereinafter MRAM) test chip with fast read and write operations.

Renesas Electronics Corporation's SmartBond™ DA1470x Family is the only solution in the Bluetooth LE space to integrate a power management unit, a hardware voice activity detector (VAD), a Graphics Processing Unit (GPU), and Bluetooth LE connectivity into a single chip. This combined functionality provides smart IoT devices with advanced sensor and graphical capabilities and ultra-low-power, always-on audio processing.

Renesas Electronics announced two new cloud development kits, CK-RA6M5 and CK-RX65N, providing a complete connectivity solution for the RA and RX Families of 32-bit microcontrollers (MCUs).

Real-Time Innovations (RTI) announced its collaboration with Renesas on the RTI Connext Drive, the ISO-26262-certified communications framework for autonomous and electric vehicles running on Renesas System-on-Chips (SoC).