A large number of electronic systems in modern vehicles are networked with one another. Because these systems are vulnerable to cyber attacks, Fraunhofer IPMS created a CANsec IP core to improve the security of vehicle systems.

Renesas Electronics Corporation announced the development of circuit technologies for a 22-nm embedded spin-transfer torque magnetoresistive random-access memory (STT-MRAM, hereinafter MRAM) test chip with fast read and write operations.

Renesas Electronics Corporation's SmartBond™ DA1470x Family is the only solution in the Bluetooth LE space to integrate a power management unit, a hardware voice activity detector (VAD), a Graphics Processing Unit (GPU), and Bluetooth LE connectivity into a single chip. This combined functionality provides smart IoT devices with advanced sensor and graphical capabilities and ultra-low-power, always-on audio processing.

Renesas Electronics announced two new cloud development kits, CK-RA6M5 and CK-RX65N, providing a complete connectivity solution for the RA and RX Families of 32-bit microcontrollers (MCUs).

Real-Time Innovations (RTI) announced its collaboration with Renesas on the RTI Connext Drive, the ISO-26262-certified communications framework for autonomous and electric vehicles running on Renesas System-on-Chips (SoC).

Renesas Electronics introduced an AUTOSAR-compliant complex device driver (CDD) software module for designers of automotive battery management systems (BMS) in electric vehicles (EVs).

Microcontroller Leader to Showcase Performance, High Integration and Security Advances at Embedded World 2022 Exhibition and Conference