On this episode of Embedded Insiders, Dr. Moritz Neukirchner, Head of Software Architecture at Elektrobit, joins us to discuss the business and technology challenges surrounding the growth of software-defined vehicles, and where OEMs and suppliers will generate the most value in automotive in the future.

On this episode of Embedded Insiders, we’re joined by Yaniv Iny, the CEO of PractiTest. The software development company is focused on providing end-to-end test management solutions, AND it is also the creator of the annual 2023 State of Testing Report. And Iny is here to share some of this year’s most notable findings. 

AI and machine learning are relatively new technologies in the embedded space. And the only way an application space can grow is by having a robust ecosystem. Some may argue that such an ecosystem already exists for AI, while others say that developers should wait a bit before diving in.

TOKYO. Renesas Electronics Corporation recently introduced the RH1NS200, an LTE NB-IoT (Narrowband Internet of Things) modem chipset specifically for operation on the networks of major Indian telecommunications carriers. The RH1NS200 chipset consumes 1uA in deep sleep mode to maximize battery life and includes an integrated EAL5+ (Evaluation Assurance Level) Secure Element (SE) that provides zero compromise on security to ensure the safety of end applications like power and water metering systems.

Tokyo, Japan. Renesas Electronics Corporation released information on its RAJ2930004AGM, a gate driver IC developed to operate high-voltage power devices such as IGBTs (Insulated Gate Bipolar Transistors) and SiC (Silicon Carbide) MOSFETs for electric vehicle (EV) inverters.

TOKYO, Japan ― Renesas Electronics Corporation announced the new RAJ2810024H12HPD, an automotive Intelligent Power Device (IPD) designed to efficiently control the power distribution of next-generation E/E (electrical/electronic) automotive architectures.

Tokyo, Japan. Renesas Electronics Corporation made available an automotive Intelligent Power Device (IPD), RAJ2810024H12HPD, for safe and flexible management of power dissemination in vehicles. The solution delivers the needs of next-generation E/E (electrical/electronic) architectures. It was designed in a TO-252-7 form factor which helps reduce the mounting vicinity by 40% when compared to the conventional TO-263.