The Movandi approach is based on patented 5G millimeter-wave chipsets, RF power amplifiers, MIMO (Multiple Input Multiple Output) antennas, BeamXR smart repeater modules, and BeamX algorithms and software. It provides mesh networking capability with redundant and dynamic routing and will soon provide control via cloud-based data centers to balance and optimize network routing based on traffic and quality of connectivity. This reduces the required number of gNBs through load-balancing traffic across networks to provide continuous connectivity, even in moving vehicles.
NORD Drive Systems High Efficiency Solutions Cover a Wide Range of Applications for Intralogistics and Warehousing - NewsAugust 26, 2021
NORD provides configurable gear units, electric motors, and variable frequency drives for precise control of conveyor systems, sortation devices, and more.
Newark Signs Distribution Agreement with Epishine to Enable Light-Energy Harvesting Within Electronic Design - NewsAugust 26, 2021
Epishine's organic solar cells are small, thin, flexible, and printed on recyclable plastic. The cells can be easily integrated into any low power electronic equipment where they convert ambient indoor light into electricity. New product designers can replace batteries in wireless sensors and similar devices with the organic solar cells, reducing the environmental impact of battery waste and saving battery replacement costs.
AAEON, a manufacturer of network platforms and edge computing solutions, has partnered with the National Taiwan University of Science and Technology (NTUST) and Chunghwa Telecom to help create the 5G Smart Manufacturing Technology Research and Validation Site (5G SMT RVS). This research and testing site is designed to operate and evaluate Multi-access Edge Computing (MEC) server implementation, focusing on developing and refining Smart Manufacturing applications which utilize 5G cellular networks.
The Global Digital Twin Market is valued at US $3.07 billion in 2020 and is expected to reach US $49.1 billion by 2027, growing at a CAGR of approximately 45.5%. As manufacturing activities are becoming gradually more digital, the digital twin is now within everyone's reach.
Rollon Acquires iMS, Expanding Its Lineup of Linear Actuator Modules and Robotic Transfer Units for Heavy Payloads - NewsAugust 25, 2021
Rollon, a manufacturer of linear motion guides, actuators, and systems, has acquired Intelligent Machine Solutions, Inc. (iMS), a Michigan-based designer and manufacturer of standard and custom machinery for the automation industry.
Optical Gaging Products (OGP®), a manufacturer of precision multisensor metrology systems for industrial quality control, announced a technological breakthrough in value-class video comparator systems: The Automatic Three-Position Lens Changer, available on c-vision™ Lite Video Contour Projectors®.
Lanner Electronics and ADVA announced that Lanner’s NCA-4025 is now verified as an Intel Select Solution for uCPE with ADVA Ensemble Connector, giving communication service providers (CSPs) and enterprises a route to virtualization at the network edge.
Utility meters need to work without interruption and often under adverse conditions. From full load to light load, through line surges, or even when being tampered with, meters require rugged and efficient power supplies to deliver power without fail.
Twelve Partners From Research and Industry Launch Joint Research Project for Trustworthy Electronics - NewsAugust 19, 2021
Coordinated by Infineon Technologies AG, the research project "Design methods and hardware/software co-verification for the unique identifiability of electronic components" (VE-VIDES) has begun operations.
Vishay Intertechnology BiAs Single-Line ESD Protection Diode Features Space-Saving DFN1006-2A Package With Side-Wettable Terminals - NewsAugust 17, 2021
Vishay Intertechnology, Inc. released a bidirectional asymmetrical (BiAs) single-line ESD protection diode in the compact new DFN1006-2A package. Saving space over solutions in SOT packages, the Vishay Semiconductors VCUT0714BHD1 offers low capacitance and leakage current for the protection of high-speed data lines against transient voltage signals.
Power saving and heat reduction benefits make DDR5 SODIMM suitable for manufacturers of high-performance embedded systems and industrial computers and accelerate the development and commercialization of next-generation computing. It supports Intel's 12th-generation Alder Lake mobile processors and is expected to enter mass production in 2022.
New I2C Serial EEPROM Introduces 3.4MHz High-Speed Mode Operation, Software Write-Protection, and Factory Programmed Serial Numbers - NewsAugust 13, 2021
I2C and SPI are two of the most widely used serial communication buses for embedded systems, and each comes with its own set of advantages and disadvantages. SPI is the faster protocol, but that comes at the expense of higher pricing and limited scalability.
Network component companies join together under Avnu Alliance to advance TSN interoperability. - NewsAugust 11, 2021
Base interoperability at the component level facilitates device interoperability across various applications and profiles, including IEEE/IEC 60802 for industrial and IEEE 802.1BA for ProAV, as well as future profiles that are in development.
AT&T and Kigen are working together to help customers streamline their supply chains and reduce the time to market for enterprises who want to leverage SIM, embedded SIM (eSIM), and integrated SIM (iSIM) secured connectivity deep in their IoT devices.
The ISA Global Cybersecurity Alliance's (ISAGCA) position paper details the automation cybersecurity public policy views of the organization and its 50 companies.
The VBox ATSC 3.0 Testbed is designed for TV stations, broadcast engineers, video system integrators, digital app developers, and others in the emerging NextGenTV technology development ecosystem looking to test “real-world” ATSC 3.0 features and functionality.
Built on the latest generation BiCS FLASH™ 3D Flash Memory, Ver. 3.1 brings a thinner profile and faster read and write speeds to applications.
Fast and low-loss switching is suitable for data centers, building automation, and other high-power electronics applications.
Vishay Intertechnology, Inc. introduced a commercial IHLP® low profile, high current inductor, the industry's first composite inductor in the 19mm by 19mm by 7mm 7575 case size.