Embedded Computing Design

I²C and SPI are two of the most widely used serial communication buses for embedded systems, and each comes with its own set of advantages and disadvantages. SPI is the faster protocol, but that comes at the expense of higher pricing and limited scalability.

Base interoperability at the component level facilitates device interoperability across various applications and profiles, including IEEE/IEC 60802 for industrial and IEEE 802.1BA for ProAV, as well as future profiles that are in development.

AT&T and Kigen are working together to help customers streamline their supply chains and reduce the time to market for enterprises who want to leverage SIM, embedded SIM (eSIM), and integrated SIM (iSIM) secured connectivity deep in their IoT devices.

The ISA Global Cybersecurity Alliance's (ISAGCA) position paper details the automation cybersecurity public policy views of the organization and its 50 companies.

The VBox ATSC 3.0 Testbed is designed for TV stations, broadcast engineers, video system integrators, digital app developers, and others in the emerging NextGenTV technology development ecosystem looking to test “real-world” ATSC 3.0 features and functionality.

Built on the latest generation BiCS FLASH™ 3D Flash Memory, Ver. 3.1 brings a thinner profile and faster read and write speeds to applications.

Fast and low-loss switching is suitable for data centers, building automation, and other high-power electronics applications.

Vishay Intertechnology, Inc. introduced a commercial IHLP® low profile, high current inductor, the industry's first composite inductor in the 19mm by 19mm by 7mm 7575 case size.

The new MOSFET reduces EMI in switching power supply application.

The TWS development kit shortens the design cycle for OEMs and accelerates the timeline to bring TWS products with advanced features to market.

Wireless power industry authority surpasses power and data speeds of NFC WLC specification within months of standard being published.

Acquisition will support continued growth in RF and microwave filtering solutions.

The system combines integration and performance in one compact, low-power device supported by Microchip’s widely deployed IEEE 1588 Precision Time Protocol (PTP) and synchronization algorithm software modules.

The integration of the Memfault SDK provides Laird Connectivity customers free access to the Memfault platform, which enables them to accelerate product development and easily monitor and update products after release.  

Company president Matt Johnson will succeed Tyson Tuttle as chief executive officer in 2022.

TTT must stop producing and distributing its TD1030 navigation chip and navigation modules with the infringing software, according to the Court's decision.

OKdo launches the first official Raspberry Pi recycling initiative in partnership with Raspberry Pi and Sony Technology Centre

Synzen's latest antenna is possibly the most compact 5G FPC antenna on the market.

The industrial-embedded 3D TLC SSD drives are tailored for extreme environments requiring high throughput and low power NVMe interface.

PemTech expands its offering to include the MPS™ sensor technology, providing a maintenance-free solution, protecting people and assets, and improving productivity.