Apacer's Industrial DDR5 SODIMM Ushers In the Next Generation of High-Performance Computing - NewsAugust 17, 2021
Power saving and heat reduction benefits make DDR5 SODIMM suitable for manufacturers of high-performance embedded systems and industrial computers and accelerate the development and commercialization of next-generation computing. It supports Intel's 12th-generation Alder Lake mobile processors and is expected to enter mass production in 2022.
New I2C Serial EEPROM Introduces 3.4MHz High-Speed Mode Operation, Software Write-Protection, and Factory Programmed Serial Numbers - NewsAugust 13, 2021
I2C and SPI are two of the most widely used serial communication buses for embedded systems, and each comes with its own set of advantages and disadvantages. SPI is the faster protocol, but that comes at the expense of higher pricing and limited scalability.
Network component companies join together under Avnu Alliance to advance TSN interoperability. - NewsAugust 11, 2021
Base interoperability at the component level facilitates device interoperability across various applications and profiles, including IEEE/IEC 60802 for industrial and IEEE 802.1BA for ProAV, as well as future profiles that are in development.
AT&T and Kigen bring SIM flexibility to cellular IoT devices - NewsAugust 11, 2021
AT&T and Kigen are working together to help customers streamline their supply chains and reduce the time to market for enterprises who want to leverage SIM, embedded SIM (eSIM), and integrated SIM (iSIM) secured connectivity deep in their IoT devices.
ISAGCA Releases Position Paper on Automation Cybersecurity Requirements in Public Policy - NewsAugust 11, 2021
The ISA Global Cybersecurity Alliance's (ISAGCA) position paper details the automation cybersecurity public policy views of the organization and its 50 companies.
Enhanced Version of TV Gateway for NextGenTV Developers & System Integrators - NewsAugust 11, 2021
The VBox ATSC 3.0 Testbed is designed for TV stations, broadcast engineers, video system integrators, digital app developers, and others in the emerging NextGenTV technology development ecosystem looking to test “real-world” ATSC 3.0 features and functionality.
KIOXIA Announces Ver 3.1 UFS Embedded Flash Memory Devices - NewsAugust 11, 2021
Built on the latest generation BiCS FLASH™ 3D Flash Memory, Ver. 3.1 brings a thinner profile and faster read and write speeds to applications.
Littelfuse 1700 V SiC Schottky Barrier Diodes Offer Faster Switching, Higher Efficiency - NewsAugust 06, 2021
Fast and low-loss switching is suitable for data centers, building automation, and other high-power electronics applications.
Vishay Intertechnology IHLPL® Commercial Inductor Offers High Temperature Operation - NewsAugust 06, 2021
Vishay Intertechnology, Inc. introduced a commercial IHLP® low profile, high current inductor, the industry's first composite inductor in the 19mm by 19mm by 7mm 7575 case size.
Toshiba launches low-spike-type 40V, N-channel power MOSFET - NewsAugust 05, 2021
The new MOSFET reduces EMI in switching power supply application.
Knowles Releases AI-Enabled TWS Development Kit - NewsAugust 05, 2021
The TWS development kit shortens the design cycle for OEMs and accelerates the timeline to bring TWS products with advanced features to market.
Wireless Charging for Wearables and Beyond - NewsAugust 05, 2021
Wireless power industry authority surpasses power and data speeds of NFC WLC specification within months of standard being published.
Knowles Precision Devices acquires Integrated Microwave Corporation - NewsAugust 03, 2021
Acquisition will support continued growth in RF and microwave filtering solutions.
First Single-Chip Network Synchronization Solution Provides Precise Timing for 5G Radio Access Equipment - NewsJuly 30, 2021
The system combines integration and performance in one compact, low-power device supported by Microchip’s widely deployed IEEE 1588 Precision Time Protocol (PTP) and synchronization algorithm software modules.
Laird Connectivity Partners with Memfault to Offer Device Observability Platform for Its Connected Low-Power Cellular and Bluetooth Product Line - NewsJuly 30, 2021
The integration of the Memfault SDK provides Laird Connectivity customers free access to the Memfault platform, which enables them to accelerate product development and easily monitor and update products after release.
Silicon Labs Initiates CEO Transition Plan Amid Strong Growth and Increased Demand of Wireless Technology - NewsJuly 30, 2021
Company president Matt Johnson will succeed Tyson Tuttle as chief executive officer in 2022.
u-blox Wins Chinese Court Ruling Against Techtotop in Patent and Copyright Infringement Suits - NewsJuly 29, 2021
TTT must stop producing and distributing its TD1030 navigation chip and navigation modules with the infringing software, according to the Court's decision.
OKdo Renew Offers Customers the Opportunity to Return Selected Raspberry Pi Boards for a Reward - NewsJuly 29, 2021
OKdo launches the first official Raspberry Pi recycling initiative in partnership with Raspberry Pi and Sony Technology Centre
ARCTURUS ultra-compact 5G FPC antenna proves great things come in small packages - NewsJuly 27, 2021
Synzen's latest antenna is possibly the most compact 5G FPC antenna on the market.
Virtium Introduces M.2 NVMe PCIe Gen4 Industrial SSD Platform - NewsJuly 27, 2021
The industrial-embedded 3D TLC SSD drives are tailored for extreme environments requiring high throughput and low power NVMe interface.