Assistant Managing Editor

Embedded Computing Design

Tiera Oliver, Assistant Managing Editor for Embedded Computing Design, is responsible for web content edits, product news, and constructing stories. She develops content and constructs ECD podcasts, such as Embedded Insiders. Before working at ECD, Tiera graduated from Northern Arizona University, where she received her B.S. in journalism and political science and worked as a news reporter for the university’s student-led newspaper, The Lumberjack.

Articles 721 - 740
IoT

Energous and TAGnology Partner to Bring Over-The-Air Wireless Power Solutions to European Customers - News

September 07, 2021

Energous Corporation announced a partnership with TAGnology RFID GmbH, a European provider of wireless technology, contactless identification, and RTLS (real time location system) solutions serving a range of applications from industrial, medical, automotive, to Internet of Things (IoT).

Security

MIPI D-PHY v3.0 Doubles Data Rate of Physical Layer Interface and Extends Power Efficiency - News

September 03, 2021

The MIPI Alliance announced an update to its MIPI D-PHY specification for connecting megapixel cameras and high-resolution displays to application processors.

AI & Machine Learning

Technology Choices and Supply Chain Management Are the Key Enablers of LiDAR Adoption - News

September 02, 2021

The market for LiDAR in automotive and industrial applications is expected to reach US$5.7 billion in 2026, showing a significant 21% CAGR between 2020 and 2026”, asserts Alexis Debray, PhD. Senior Technology & Market Analyst, Photonic, Sensing & Semiconductor at Yole Développement (Yole). “In 2020, the LiDAR in ADAS represented only 1.5% of the automotive and industrial LiDAR market. But the ADAS proportion is expected to reach 41% in 2026.”

Consumer

MicroEJ and NXP Collaborate to Enable Ultra Low power Optimization On The i.MX RT500 Crossover MCUs for Wearables - News

September 01, 2021

MicroEJ announced their collaboration with NXP Semiconductors to offer a dedicated MICROEJ VEE on-device platform based on NXP’s i.MX RT500 MCU focusing on ultra-low-power, security, and user interfaces.

Software & OS

MicroEJ Announces Availability of MICROEJ Kifaru, a Javascript Development Environment for Embedded Devices - News

September 01, 2021

MicroEJ released its new JavaScript framework for embedded development, called MICROEJ Kifaru. This new addition is designed to fulfill the company’s mission to democratize embedded development to the broadest ecosystem of skilled applications developers on the market.

Processing

Xilinx and Motovis Introduce Complete Hardware and Software Solution to Further Automotive Forward Camera Innovation - News

September 01, 2021

Xilinx and Motovis, a provider of embedded AI autonomous driving, announced that the two companies are collaborating on a solution that pairs the Xilinx Automotive (XA) Zynq system-on-chip (SoC) platform and Motovis’ convolutional neural network (CNN) IP to the automotive market, specifically for forward camera systems’ vehicle perception and control.

Automotive

New Vishay Intertechnology Thin Film Chip Fuse Offers AEC-Q200 Qualification for Automotive Applications - News

August 30, 2021

Vishay Intertechnology introduced a new, fast-acting thin film chip fuse. For automotive applications, the Vishay Beyschlag MFU 0603 AT is AEC-Q200 qualified and features current ratings from 0.5 A to 5.0 A.

Healthcare

The AI-Based Medical Device Industry Evolves Due to the Integration of Various Advanced Technologies - News

August 30, 2021

The Artificial Intelligence Based Medical Device Market Ecosystem is Expected to Grow at a CAGR of 25.7% by Forecast Year 2027.

Automotive

Vishay Intertechnology Automotive Grade IHLP Inductor in 2020 Case Size Offers Operating Temperature to +180 °C - News

August 30, 2021

Vishay Intertechnology expanded its offering of high temperature Automotive Grade IHLP low profile, high current inductors with a new device in the 2020 case size.

Automotive

Rolling Wireless to Deliver 5G Car Connectivity Solutions using Qualcomm Technologies Automotive Platforms - News

August 30, 2021

Rolling Wireless extended its portfolio of automotive-grade telematics modules with a 5G product series. The 5G RN91xx, based on Qualcomm Technologies' Snapdragon Automotive 5G Platform, is designed to deliver 5G connectivity solutions to car original equipment manufacturers (OEMs) and Tier-1 suppliers.

Open Source

Surveys Say Python is the Next Programming Language You Will Use - Story

August 27, 2021

When it comes to software, it’s a polyglot world.

Storage

sureCore Meets Demands for Ultra-Low Power Memory Solutions - News

August 26, 2021

sureCore, the ultra-low power memory provider, announced their low voltage SRAM and Register File memory solutions. According to the company, their SRAM IP is designed to cut memory power requirements by up to 50%.

Analog & Power

Lattice Certus-NX FPGAs Optimized for Automotive Applications - News

August 26, 2021

Lattice Semiconductor expanded its portfolio of automotive products with the announcement of versions of the Lattice Certus-NX FPGA family optimized for infotainment, advanced driver assistance systems (ADAS), and safety-focused applications.

Networking & 5G

​​Wind River and Intel Collaborate on Leading 5G vRAN Solution for FlexRAN - News

August 25, 2021

Wind River announced that they are jointly developing a 5G vRAN solution with Intel. The solution integrates Intel FlexRAN reference software for systems fueled by 3rd Gen Intel Xeon Scalable processors with built-in AI acceleration, and also features Intel Ethernet 800 Network Adapters and the Intel vRAN Dedicated Accelerator ACC100 in concert with Wind River Studio.

Analog & Power

New AEC-Q200 Compliant Fuses with High DC Voltage Rating - News

August 24, 2021

Bel Fuse-Circuit Protection, a Bel group company, announced the 0ACH Series of high current SMD brick fuses. The series offers high current ratings and high interrupting ratings within a small package size of 4.5 x 4.5 x 12.3 mm.

AI & Machine Learning

eCapture Launches Small Form Factor 3D Stereo Depth Sensing Camera for Robotics and Object Tracking - News

August 23, 2021

eCapture, a brand focused on developing technology for the growing computer vision market, introduced the small form factor stereoscopic 3D depth sensing camera.

IoT

Link Labs Releases Its Patented Xtreme Low Energy (XLE) Technology - News

August 23, 2021

Link Labs announced the release of its Xtreme Low Energy (XLE) technology for IoT asset tracking. A patented wireless communication method, XLE is designed to extend the battery life of Bluetooth Low Energy (Bluetooth LE) tags by more than 400%, or by up to three years longer, and enables accuracy in asset location within one meter.

AI & Machine Learning

Derq Joins the Qualcomm Smart Cities Accelerator Program - News

August 20, 2021

As part of the Qualcomm Advantage Network, the Qualcomm Smart Cities Accelerator Program is designed to connect cities, municipalities, government agencies, and enterprises with an ecosystem of providers offering end-to-end smart city solutions.

Automotive

Versinetic’s “Periodic Table” Explains Jargon, Acronyms and Tech Terms in the EV Sector - News

August 19, 2021

With the growth of Electric Vehicles (EVs), comes a whole new set of jargon, acronyms and tech terms. Versinetic has compiled an interactive periodic table of over 100  terms and abbreviations to make navigating the EV landscape easier.

Automotive

Mapbox Supports what3words in Dash, For Precise In-Car Navigation - News

August 17, 2021

Mapbox, a mapping and location cloud platform for developers, now offers what3words support in Dash, their turnkey application that car makers use to create custom in-car navigation.

Articles 721 - 740