Embedded Computing Design

Varon Vehicles and Real-Time Innovations (RTI) announced they will be collaborating to integrate RTI’s software connectivity framework into Varon Vehicles’ Traffic Management Systems (TMS).

The MIPI Alliance announced the next generation of its MIPI Display Serial Interface 2 (MIPI DSI-2) specification. MIPI DSI-2 v2.0 is designed to deliver improvements to the user experience while boosting power savings across application spaces such as mobile, automotive, and gaming.

Named “Eagle”, this new computer from VersaLogic features Intel’s “Coffee Lake Refresh” Xeon processor. The Eagle also includes high-speed on-board NVMe SSD storage, ECC memory, Ethernet, TPM 2.0 security, GPIO, and USB ports, as well as a SATA port for off-board storage.

Rambus Inc. announced the Rambus HBM3-ready memory interface subsystem consisting of a fully-integrated PHY (1) and digital controller (2). Supporting data rates of up to 8.4 Gbps, the solution is designed to deliver over a terabyte per second of bandwidth, more than double that of high-end HBM2E memory subsystems.

Mixel, Inc. announced that it has achieved ISO 9001 Quality Management System Certification by DEKRA Certification, Inc. and ISO 26262 certification for automotive functional safety by SGS-TUV Saar GmbH.

Developed by METCASE, the new 10.5-inch enclosures are designed for mounting half-width (42HP) subracks, chassis and front panels. They are suitable for desktop and portable applications including test and measurement, networking and communications, industrial computers, sound and studio systems, laboratory instrumentation, and industrial control.

PICMG announced the release of the COM-HPC Platform Management Interface (PMI) specification. It provides a framework of remote and out-of-band platform management features for COM-HPC Computer-on-Module based edge computing designs and is freely available on the PICMG website.

Winbond announced that the company's TrustME W77Q Secure Flash has obtained Common Criteria EAL2 and ISO 26262 ASIL-C Ready certifications from SGS Brightsight and SGS-TÜV Saar GmbH, respectively.

BlackBerry Limited announced a new solution to deliver highly-secure vehicle-based payment capability to unlock a connected car payments market that is projected to reach over €530 billion by 2030 (1).

The new MEMS scanner solution from Infineon Technologies AG features a MEMS mirror and MEMS driver for new product designs. Its miniature size and low power consumption enable augmented reality (AR) solutions for consumer applications such as wearables and for automotive head-up displays.

Real-Time Innovations (RTI) announced it has joined the VR/AR Association (VRARA) to expand the use of their gaming engine connectivity capabilities with RTI Connext DDS across all markets.

Avnet Embedded expanded its COM Express product portfolio with the new MSC C6B-TLH COM Express Type 6 module family based on 11th Generation Intel CoreTM H-Series processors (formerly codenamed “Tiger Lake - H”), offering high computing, graphics, and video performance.

Leopard Imaging Inc. and eYs3D are jointly developing the first GMSL & GMSL2 3D depth cameras. These cameras are well suited for autonomous mobile operation, enabling them to provide visual data across large areas including outdoor environments and manufacturing floors.

ADLINK Technology introduced its new Express-TL COM Express Type 6 module with Intel CoreTM, Xeon W, and Celeron 6000 processors and octa-core (8-core) performance.

The global semiconductor shortage will have prolonged effects that are likely to have a greater impact on the automotive industry than the COVID pandemic, according to software provider VNC Automotive.

Softing adds to its Docker technology-based edgeConnector product family. The new edgeConnector Modbus is a flexible Docker container application for Modbus TCP controllers.
 

NVIDIA maintained its position in the global market for artificial intelligence (AI) processors used in the cloud and in data centers in 2020, with an 80.6% share of global revenue, according to Omdia.

ON Semiconductor announced its new trade name “onsemi” and their strategy to enable and contribute to a sustainable ecosystem of trends such as vehicle electrification, advanced safety, alternative energy, and factory automation.

congatec introduced 20 new Computer-on-Modules following the launch of Intel’s 11th generation Core processor for IoT. Featuring 11th Gen Intel Core vPro, Intel Xeon W-11000E, and Intel Celeron processors, the new modules are designed to target demanding IoT gateway and edge computing applications.

STMicroelectronics announced PSA Certified Level-3 and SESIP 3 certifications for its general-purpose secure STM32U585 microcontroller, passing tests for logical, board, and basic physical resistance that confirm a substantial level of cyber protection.