Embedded audio systems increasingly require more sophisticated audio capabilities, both in smaller, denser, feature-rich devices where EMI, power, and space are critical constraints, and in large devices where audio data streams must be reliably transmitted over multi-meter wire lengths.

Behind the scenes in a modern PC or server lies a critical sideband communication channel—the System Management Bus (SMBus)—keeping major system components such as the CPU, memory, batteries and power supply running smoothly. It monitors temperature, voltage and current, and controls power delivery across the system, helping each component operate at peak efficiency.

Today, automotive technology is advancing faster than ever, with the latest electronic components now central to the design and success of new vehicles.

Hello Embedded Engineers, Developers and Makers! Welcome to In Case You Missed it: Embedded Insights, the weekly news show all about Embedded technologies and solutions from Embedded Computing Design.

Advancements in image sensor technology are enabling a host of new applications, leveraging more advanced image sensing capabilities, in smaller form factors, with lower power consumption and lower cost. Examples include cars using cameras, radars, and lidars to become more autonomous; autonomous drones performing aerial reconnaissance with beyond-line-of-sight operation; industrial robots using high-resolution image processing to perform real-time quality control; and advanced endoscopic medical imaging resulting in faster diagnosis and treatment.

MIPI Alliance will be attending embedded world 2024 with twelve presentations spotlighting MIPI specifications. Presentations will showcase MIPI camera and display specifications, MIPI's significance in automotive technology, and the MIPI I3C utility and control bus.

The MIPI Alliance, an international mobile interface specifications organization, updated its application-agnostic MIPI UniPro transport layer for chip-to-chip/interprocessor communication (IPC) applications in traditional and modular device architectures. Version 2.0 includes features that double the data rate, while improving throughput and decreasing latency.