DFI, a global leader in embedded motherboards and industrial computers, today announced that they will be participating in Embedded World 2023 and joining Qualcomm Technologies, Inc. to showcase the world’s first SBC equipped with the high-performance Qualcomm® QRB5165 processor. With high integration capability and anti-vibration features, the product can be applied in fields such as industrial automation and AMR. It is expected to increase the overall AI edge computing efficiency and bring more capabilities to the industry.

DFI’s PCSF51 is the next-generation 1.8” single board computer that boosts performance to a new level .Featuring AMD Ryzen™ Embedded R2000 Series SoCs, this extremely compact credit card size SBC comes in an 84mm x 55 mm form factor with optimized power and sharp graphics. The all-new AMD Ryzen™ R2000 doubles the max CPU core count, providing up to 4U/8T, 8x GPU CU computing power.PCSF51 offers a wide range of scalability through various expansion slots, including SATA 3.0, USB 3.1, and M.2 expansion. It also supports up to 16 PCIe Gen3 connectivity to accommodate a broad range of I/O requirements

DFI’s ECX700-AL is a Ruggedized Embedded System, With IP67/69K waterproof and dust-proof design to withstand harsh environments and any type of climate. Stable performance is ensured with its wide operating temperature of -40 to 70 degrees Celsius. It is also equipped with a smart vent that drains water automatically. High quality wireless transmission is ensured with a high gain antenna to maximize signal strength and an external SIM slot for easy accessibility. Versatile I/O, including selective display ports (HDMI/VGA) and a combo port that supports 2 CANs and 2 COMs, allows for integrators to meet demands of various applications. 

DFI has plans to release a new 181.6mm x 57mm x 118.4mm, fanless Edge AI inference computer, the EC70A-TGU, powered by Intel® 11th Gen Tiger Lake Core™ processors and featuring 8GB of onboard memory for AI applications such as industrial automation, smart transportation, medical imaging, AMRs/AGVs, and more.