Modern edge AI applications are increasingly evolving. Devices such as hearables, wearables, AI cameras, and drones are being developed so that they no longer rely on centralized cloud AI, and instead can be supported by on-device AI that keeps data closer to the source, therefore improving latency, energy consumption, and bandwidth and connectivity limitations.

During its exhibition at embedded world Germany, EMASS (Hall 4, Booth 4-483) will have application specific demonstrations with its ECS-DoT system-on-chip (SoC), a milliwatt-class, on-device AI platform designed for always-on intelligence, ultra-low latency, and reduced power consumption. Demos will highlight how ECS-DoT enables continuous sensing, inference, and decision-making directly on-device, without reliance on the cloud or regular battery replacement.

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EMASS publicized that it is collaborating with Semtech to offer low-power edge AI solutions integrated with LoRaWAN connectivity. EMASS’s ECS-DoT AI-enabled system-on-chips (SoCs) will integrate Semtech’s LoRa transceivers, supporting long-range, battery-efficient intelligence for industrial, IoT, and other connected applications. The systems are expected to process data locally, reduce network load, and deliver actionable insights in real time, even in power-constrained environments.

MosChip Technologies is now supporting EMASS’s RISC-V based ECS-DoT Edge AI System-on-Chip (SoC). It integrates dual neural accelerators and 4MB of on-chip memory. The SoC facilitates real-time, milliwatt-class inference for vision, audio, and sensor workloads without dependance on the cloud. The ultra-low-power chip provides always-on AI capabilities for drones, wearables, healthcare trackers, and industrial monitoring systems.

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During January 6–9, 2026 in Las Vegas, Nevada at CES, EMASS will exhibit its ECS-DoT system-on-chip (SoC). The SoC is considered a milliwatt-class, on-device AI platform designed to deliver always-on intelligence with ultra-low latency and reduced power consumption.