SEMI and the UCLA Center for Heterogeneous Integration and Performance Scaling (UCLA CHIPS) revealed that they have won a $300,000 grant from the U.S. Department of Commerce’s National Institute of Standards and Technology (NIST) to produce a roadmap for advancing heterogeneous integration and advanced packaging technologies in the United States.
Worldwide silicon wafer area shipments in 2021 increased 14% while wafer revenue rose 13% compared to 2020, topping $12 billion to reach new all-time highs, the SEMI Silicon Manufacturers Group (SMG) reported in its year-end analysis of the silicon wafer industry.
Global fab equipment spending for front end facilities is expected to rise 10% year-over-year (YOY) in 2022 to a new all-time high of over US$98 billion, marking a third consecutive year of growth, SEMI highlighted in its quarterly World Fab Forecast report.
Maheen Hamid of Breker Verification Systems Appointed to SEMI ESD Alliance Governing Council - Press ReleaseNovember 18, 2021
The Electronic System Design Alliance, a SEMI Technology Community, announced the appointment of Maheen Hamid, Chief Operating Officer and Chief Financial Officer of Breker Verification Systems, to its Governing Council.
SEMI FlexTech Invites Proposals for Funding Flexible Hybrid Electronics Advancements - Press ReleaseJune 25, 2020
EMI FlexTech today released a Request for Proposals (RFP) for advanced technology developments of flexible hybrid electronics (FHE) for sensors, power and other key electronic components.
SEMI announced worldwide semiconductor manufacturing equipment billings contracted 13% to US$15.57 billion quarter-over-quarter in Q1 2020 but increased 13% year-over-year.
SEMI announced today that leading German vehicle manufacturer Volkswagen AG has joined SEMI.