We’ve had this discussion (debate? argument?) before—is it time for 8-bit MCUs to go away and be replaced by 32-bit devices that obviously offer way more functionality and come pretty close in cost? The discussion is back on the table thanks to an announcement STMicroelectronics made this week, making the latest entrant in its STM32 family a potential 8-bit killer.

Geneva. STMicroelectronics’ developed the STNRG011A digital power combination controller for 90W to 300W power supplies to be utilized in power adapters, chargers, television energy, and lighting power supplies. The STNRG011A embeds a power-factor correction (PFC) controller, LLC resonant half-bridge controller, 800V startup circuitry, and supervisory engine featuring an 8-bit core and dedicated peripherals, with digital algorithms accumulated within internal ROM.

Geneva. STMicroelectronics ratified its TouchGFX software package for simpler user interface (UI) designs that work collaboratively with STM32 microcontrollers. The 4.21 runs through the NeoChrom GPU processor, and utilizes TouchGFX Stock to control graphics for end-products.

Geneva. STMicroelectronics’ STNRG011A digital power combination controller for 90W to 300W power supplies showcases improved overload management, power-factor correction (PFC) controller, LLC resonant half-bridge controller, 800V startup circuitry, and supervisory engine.

Geneva – STMicroelectronics launched new silicon-carbide (SiC) high-power modules that are designed to increase the performance and driving range of electric vehicles. The five new SiC-MOSFET based power modules have been chosen by Hyundai to be used in the E-GMP electric-vehicle platform shared by KIA EV6 and several models.

Geneva. STMicroelectronics updated its X-CUBE-TCPP software pack with improvements to its portfolio of USB Type-C port-protection ICs and STM32 interface ICs operating from 5V/0.5A up to 48V/5A (240-Watt) within ratification 3.1. The specification provides libraries for three USB Type-C port-protection ICs in ST’s portfolio, the TCPP01-M12 for sink applications, the TCPP02-M18 for source applications, and the TCPP03-M20 for dual-role power (DRP) applications.

Geneva (Switzerland) and Bernin (France). “The automotive industry is facing major disruption with the advent of electric vehicles,” said Bernard Aspar, Chief Operating Officer of Soitec.  Having deciding on a path toward the inevitable, STMicroelectronics, along with Soitec, are ramping up their cooperation on Silicon Carbide (SiC) substrates by way of STMicroelectronics utilizing Soitec’s SmartSiC technology for a transition to 200mm SiC wafers. “The transition to 200mm SiC wafers will bring substantial advantages to our automotive and industrial customers as they accelerate the transition toward electrification of their systems and products. It is important in driving economies of scale as product volumes ramp,” said Marco Monti, President Automotive and Discrete Group, STMicroelectronics.