THE PICMG COM-HPC SUBCOMMITTEE
Embedded systems are specified for varying requirements, typically based on the application it will drive. It could be long life, low power, small size, or maximum compute power. If your application fits the latter category—maximum compute power—then the ADLINK Technology COM-HPC Ampere Altra server module likely fits the bill for you.
COM-HPC was officially ratified about six months ago. Embedded Computing Design has done a nice job covering the spec and many of the products that have come out of the spec (some before ratification and many after). We also posted a series of videos (called COM-HPC Academy) with some of the influential members of PICMG, the standards body behind the spec.
New Computer-On-Module (COM) High-Performance Computing (HPC) specification targets the increasing server-level requirements of high-end computing applications on the edge.
For the first time in many years, high-end embedded processors are available on two Computer-on-Module form factor options, COM-HPC® Client and COM Express® Type 6.
The PCI Industrial Computer Manufacturers Group (PICMG) announced it is completing the development of a new COM-HPC computer-on-module specification for the industrial edge computing market.
What the embedded computing industry is preparing for is the next generation of standards for modular system designs. COM-HPC will be THE focus of nearly all embedded computing vendors.
It?s a wonderful gift that the PICMG was brought to us with the approval of the pinout for the new high-performance COM?HPC Computer-on-Module specification.