Winbond Electronics

Winbond Electronics
Articles related to Winbond Electronics

The Storage Technology Revolution in IoT - Blog

February 22, 2023

In a recent IoT Analytics Research report, the IoT semiconductor market is set to grow from $33 billion (in 2020) to $80 billion by 2025, with the four fastest growing fields being IoT microcontrollers (MCUs), IoT connectivity chipsets, IoT AI chipsets, and IoT security chipsets and modules to achieve better performance and lower power in applications such as smart watches, automotive, and smart homes.

Analog & Power

What You Missed at electronica 2022 - Blog

December 06, 2022

Another trade show is in the books, and I’m pleased to report things are about as back to normal as they are likely to get. The show I’m referring to is electronica, which is held bi-annually in Munich, Germany. As such, it’s been four years since we’ve convened at what it is generally considered the world’s largest event for the embedded and electronics industries.

AI & Machine Learning

Choosing the Right Flash Memory for AI Endpoint Applications - Story

June 27, 2022

Everyone will agree how important high-quality, high-reliability, and low-latency Flash Memory is for AI chips and applications. Finding the right balance of performance, power consumption, security, reliability, high efficiency for different applications is crucial. Cost, although important, should not be the most important consideration.


Winbond Proceeds with More DDR3 SDRAM Production - News

April 25, 2022

Winbond Electronics Corporation announced significant enhancements to its DDR3 product on the ultra-high-speed performance.


Winbond & Infineon Technologies Collaborate to Double Bandwidth for IoT Applications with HYPERRAM 3.0 - News

April 19, 2022

Winbond Electronics Corporation, together with Infineon Technologies, has announced the expansion of their HYPERRAM product collaboration with the new higher bandwidth HYPERRAM 3.0.  


Embedded Executive: Johnson Chen, Executive, Winbond - News

September 08, 2021

The global chip shortage continues to rage on, and it appears to be worsening rather than getting better.


Winbond TrustME W77Q Secure Flash Obtains Common Criteria EAL2 and ISO 26262 ASIL-C Ready Certifications - News

August 11, 2021

Winbond announced that the company's TrustME W77Q Secure Flash has obtained Common Criteria EAL2 and ISO 26262 ASIL-C Ready certifications from SGS Brightsight and SGS-TÜV Saar GmbH, respectively.