Another trade show is in the books, and I’m pleased to report things are about as back to normal as they are likely to get. The show I’m referring to is electronica, which is held bi-annually in Munich, Germany. As such, it’s been four years since we’ve convened at what it is generally considered the world’s largest event for the embedded and electronics industries.
Everyone will agree how important high-quality, high-reliability, and low-latency Flash Memory is for AI chips and applications. Finding the right balance of performance, power consumption, security, reliability, high efficiency for different applications is crucial. Cost, although important, should not be the most important consideration.
Winbond Electronics Corporation announced significant enhancements to its DDR3 product on the ultra-high-speed performance.
Winbond & Infineon Technologies Collaborate to Double Bandwidth for IoT Applications with HYPERRAM 3.0 - NewsApril 19, 2022
Winbond Electronics Corporation, together with Infineon Technologies, has announced the expansion of their HYPERRAM product collaboration with the new higher bandwidth HYPERRAM 3.0.
The global chip shortage continues to rage on, and it appears to be worsening rather than getting better.
Winbond TrustME W77Q Secure Flash Obtains Common Criteria EAL2 and ISO 26262 ASIL-C Ready Certifications - NewsAugust 11, 2021
Winbond announced that the company's TrustME W77Q Secure Flash has obtained Common Criteria EAL2 and ISO 26262 ASIL-C Ready certifications from SGS Brightsight and SGS-TÜV Saar GmbH, respectively.
Winbond’s Interoperability of OctalNAND Flash with Synopsys DesignWare AMBA IP Delivers Complete High-Density NAND Flash Solution - NewsJuly 22, 2021
Flash optimizes data transfer rate with low latency for NAND with serial octal interface targeting automotive, mobile, and IoT SoCs