Winbond Electronics
Storage
Winbond Proceeds with More DDR3 SDRAM Production - News
April 25, 2022Winbond Electronics Corporation announced significant enhancements to its DDR3 product on the ultra-high-speed performance.
IoT
Winbond & Infineon Technologies Collaborate to Double Bandwidth for IoT Applications with HYPERRAM 3.0 - News
April 19, 2022Winbond Electronics Corporation, together with Infineon Technologies, has announced the expansion of their HYPERRAM product collaboration with the new higher bandwidth HYPERRAM 3.0.
Processing
Embedded Executive: Johnson Chen, Executive, Winbond - News
September 08, 2021The global chip shortage continues to rage on, and it appears to be worsening rather than getting better.
Storage
Winbond TrustME W77Q Secure Flash Obtains Common Criteria EAL2 and ISO 26262 ASIL-C Ready Certifications - News
August 11, 2021Winbond announced that the company's TrustME W77Q Secure Flash has obtained Common Criteria EAL2 and ISO 26262 ASIL-C Ready certifications from SGS Brightsight and SGS-TÜV Saar GmbH, respectively.
Processing
Winbond’s Interoperability of OctalNAND Flash with Synopsys DesignWare AMBA IP Delivers Complete High-Density NAND Flash Solution - News
July 22, 2021Flash optimizes data transfer rate with low latency for NAND with serial octal interface targeting automotive, mobile, and IoT SoCs
Consumer
Winbond and Ambiq Enable Intelligent IoT and Wearables on Ultra-low Power - News
May 26, 2021Winbond Electronics and Ambiq announced a collaboration to combine HyperRAM and Apollo4 to deliver ultra-low power system solutions for IoT endpoints and wearables.
Automotive
The Hidden Security Risks of Automotive Electronic Systems - Story
May 12, 2021The Internet of things (IoT) is driving new capabilities that are transforming how we live, work, and play.