Cadence Design Systems
Cadence Tensilica Vision P1 DSP - Product
June 16, 2022The latest in the popular Cadence® Tensilica® Vision DSP family, the Tensilica Vision P1 DSP is a high-performance, ultra-low power vision processor IP designed to address the emerging always-on (AON) market.
Light Leverages Cadence Tensilica Vision Q7 DSP for Enhanced Depth Perception in Next-Generation ADAS Systems - News
January 14, 2022Light™ and Cadence Design Systems announced that Light has deployed the Cadence Tensilica Vision Q7 DSP for use in Light's Clarity Depth Perception Platform, which provides long-range, high-resolution depth perception using industry-standard cameras benefiting advanced driver-assistance systems (ADAS).
Cadence Accelerates Intelligent SoC Development with Comprehensive On-Device Tensilica AI Platform - News
September 13, 2021Cadence Design Systems announced its Tensilica AI Platform for accelerating AI SoC development, including three supporting product families optimized for varying data and on-device AI requirements.
Cadence Design Tool Implements ML for More Effective Digital IC Design - Blog
August 02, 2021When I first heard about this, it sounded like a little smoke and mirrors, to be able to work the latest buzzwords into the product’s announcement. But a deeper dive reveals that ML implementation is really taking place here.
Jensen's New "Arm" & How to Advance Voice Processing with Classic DSP - Podcast
July 27, 2021In this week’s Embedded Insiders, Brandon and Rich try to decide if data sheets specs are reliable, or if industry benchmarks are the only reasonably- accurate measure of component performance without actually testing them yourself.
Classic DSP, New Neural Networks & Better Benchmarks Improve Local Voice Activation at the Edge - Story
July 19, 2021If you’ve ever used a virtual assistant, you likely assumed you were talking to a device so smart it could answer almost any question you asked it. Well, actually, Amazon Echos, Google Homes, and other devices like them usually have no idea what you’re talking about.
Presto Engineering and Cadence Collaborate on IC Packaging for Automotive and IoT Markets - News
July 07, 2021Presto Engineering and Cadence Design Systems announced a collaboration to broaden semiconductor package design solutions and expertise for high-performance system-in-package (SiP) development for the automotive and Industrial IoT markets