Presto Engineering and Cadence Collaborate on IC Packaging for Automotive and IoT Markets

By Tiera Oliver

Assistant Managing Editor

Embedded Computing Design

July 07, 2021

News

Presto Engineering and Cadence Collaborate on IC Packaging for Automotive and IoT Markets

Presto Engineering and Cadence Design Systems announced a collaboration to broaden semiconductor package design solutions and expertise for high-performance system-in-package (SiP) development for the automotive and Industrial IoT markets

Presto is adopting the Cadence system design and analysis portfolio for advanced IC packaging, which includes the Cadence Allegro X Package Designer Plus, Clarity 3D Solver, Sigrity XtractIM technology, and Celsius Thermal Solver, on an exclusive basis in order to design IC packaging solutions for its automotive and IoT customers. In addition, Presto plans to provide Cadence with input on software features, functions, and workflows specific to Cadence's end customer and market needs.
 
SiP and 3D packages, especially those with high-reliability requirements, tend to require multiple spins in order to optimize the bill of materials and design tolerances, as well as to achieve full control of the chip's performance reproducibility. Cadence solutions, coupled with manufacturing knowledge and planning during the design process, are designed to help to reduce design spins and speed time to market.

Presto's ability to provide a suite of analytical qualification services within a single facility is also designed to further reduce the time to market for its customers. The Cadence system design and analysis portfolio for advanced IC packaging supports Cadence's Intelligent System Design strategy, enabling SoC design. Now, with the addition of the Cadence portfolio, Presto offers a set of design and qualification tools to help customers achieve an efficient design-for-manufacturing (DFM) process.

For more information, visit: cadence.com or presto-eng.com

Tiera Oliver is the assistant managing editor at Embedded Computing Design. She is responsible for web content editing, product news, and story development. She also manages, edits, and develops content for ECD podcasts, including Embedded Insiders.

She utilizes her expertise in journalism and content management to oversee editorial content, coordinate with editors, and ensure high-quality output across web, print, and multimedia platforms. She manages diverse projects, assists in the production of digital magazines, and hosts company podcasts by conducting in-depth interviews with industry leaders to deliver engaging and insightful discussions.

Tiera attended Northern Arizona University, where she received her bachelor's in journalism and political science. She was also a news reporter for the student-led newspaper, The Lumberjack. 

More from Tiera