Semiconductors are the building blocks of modern electronic devices. They are used in everything from smartphones to laptops, cars, medical equipment, and even space exploration. The continuous advancement of semiconductor technology drives innovation across industries, allowing for the creation of new and improved products.

Manufacturers are looking to automation vendors to deliver systems and technologies that will help them create Connected Industries, Smart Factories, and integration with Industry 4.0 and the Industrial Internet of Things (IIoT).  Automation vendors are looking to technology providers to have access to the latest in technology, deliver greater performance and reliability, and reduce costs and complexity. That is where Ethernet, with TSN (Time Sensitive Networking) comes in.

Let’s discuss the challenges first.

On this episode of Embedded Insiders, Tom Burke, Global Strategic Advisor for CC-Link Partner Association, also known as the CLPA, joins us again to discuss the impact of TSN technology on IT/OT convergence.

On this episode of Embedded Insiders, we’re speaking with Tom Burke, Global Strategic Advisor for the CC-Link Partner Association (CLPA) about the CC-Link IE TSN, the latest open industrial network TSN that enables deterministic communication on a single network architecture.
 

Mitsubishi Electric will be testing several of their CC-Link IE TSN-certified industrial automation devices at the next Industry IoT Consortium (IIC) Plugfest at the University of Stuttgart on September 26th-27th, 2022 as part of the Testbed on Time-Sensitive Networking (TSN). The IIC Plugfest TSN Testbed is designed to give infrastructure providers a chance to validate their solutions againstt IEEE 802.1, with a goal of validating interoperability between local stations and external vendor switches. to enable OT and IT convergence.

Industry 4.0 is the inevitable next step for manufacturing facilities. However, making that transition is not a simple flip of a switch.