Munich, Germany. Two innovative Ferroelectric RAM (F-RAM) memory devices were added to Infineon Technologies AG’s EXCELON FRAM series. With both 1Mbit (first automotive-qualified serial FRAM) and 4Mbit densities, the devices are AEC-Q100 Grade 1 qualified, operating between -40°C to +125°C. The read/write capabilities climb to 50MHZ in SPI mode and in Quad SPI (QSPI) mode, 108 MHz.

Uppsala, Sweden. IAR will fully support the latest CYT6BJ series from Infineon’s 32-bit TRAVEO T2G Body MCU family. The IAR Embedded Workbench for Arm delivers code analysis tools C-STAT and C-RUN aiding designers utilizing TRAVEO T2G MCUs.  

Munich, Germany and Linz, Austria. Infineon Technologies AG and the Austrian product compliance company Kontrol are collaborating on the future of legally compliant and safe mobility applications. Kontrol will deliver translation and digitalization of legal regulations and on-road standards into machine-readable language.

Light electric vehicles (LEVs) are part of the urban e-mobility megatrend, though not as commonly discussed in the media and technology sectors as EV passenger cars in the global setting. LEVs are generally smaller and lighter than traditional EVs, and are designed for personal transportation and include a range of vehicles, such as electric bicycles (e-bikes), scooters, motorcycles, rickshaws, and microcars (quadricycles).

It took a little explaining for me to understand this one, but now it makes sense, a lot of sense.

MUNICH, Germany. Infineon Technologies AG recently introduced the first generation of its ISOFACE™ dual-channel digital isolators, which are designed for robust high-voltage isolation and are pin-to-pin compatible with offerings from other suppliers.

USB charging has become the de-facto method for charging several portable devices we use these days, most notably smartphones, notebooks, and tablets.