Technologies to enable connectivity in the automobile are accelerating at a staggering pace. In the past, the electrical connections drove basic functions, and wireless connections weren’t even considered due to limited reliability and performance that wasn’t up to snuff.
MUNICH, GERMANY. Smart home solutions are designed not only to make life easier, but to do it in ways that are more sustainable for the planet as a whole and its individual resources. Up until recently, establishing a secure, fully connected smart home has been a challenge because of the separate protocols and device ecosystems permeating products across the market. The Connectivity Standards Alliance’s (CSA) newly released Matter 1.0 specification aims to overcome that obstacle by providing device makers with a single standard to follow for smart home applications such as smart locks, thermostats, sensors, security systems, lighting, and more.
On this episode, Brandon is joined by Mathias Beer, Chief Product Officer at Ci4Rail, to discuss ModBlox7, a PICMG standard that helps regulate Box PCs to the rising prevalence of modularization and miniaturization.
Analog & Power
Infineon is expanding its family of AC-DC controller ICs to help amplify one of the industries fasting growing markets, battery-powered appliances.
The theoretical definition of functional safety can be taken from the ISO 26262 specification which ensures that a high level of safety is built into an automobile and its components right from the start of the design. The standard provides guidance for the entire automotive safety lifecycle, from overall risk management to individual component development, production, operation, service, and decommissioning.
As today’s data economy emerges, it demands that the valuable data we gather, share, and exchange is protected, especially in safety-critical applications where data is more valuable than nearly anywhere else.
Robust memory is one of many solutions that can help. But how can development teams quickly, safely, securely, and cost-effectively implement robust memory architectures that meet the requirements of standards like ISO 26262 and IEC 61508?
Infineon Expands Supplier Base for Silicon Carbide Wafers, Supply Agreement Signed with US-Based II-VI Incorporated - NewsAugust 26, 2022
Infineon Technologies AG and II-VI Incorporated have signed a multi-year supply agreement for silicon carbide (SiC) wafers. The German-based semiconductor manufacturer is securing further access to this strategic semiconductor material to meet the increase in customer demand in this area.