The recent pandemic was the beginning of many trends. One of those was the “work from everywhere” phenomenon, which is here to stay, at least in some form. With the number of home employees jumping in size seemingly overnight, along with it came the need for tools that could accommodate this environment, from video conferencing software to computer hardware.

Munich, Germany and Las Vegas, Nevada. Infineon Technologies AG and Altia, introduced the outcome of their partnership at CES 2023, the Arm Cortex-M4/M7 powered TRAVEO T2G Cluster microcontroller (MCU) series utilizing Altia's CloudWare software platform for display solutions.

Dresden, Germany. Infineon Technologies AG announced its European power electronics envision, Power2Power, has been finalized with success. The group of 43, coordinated by Infineon, included universities, research institutes, small and medium-sized enterprises, and international corporations. All participated in designing power semiconductors with a boost in performance and conservation of energy.

Munich, Germany and Natick, MA –MathWorks and Infineon Technologies AG announced that Infineon’s latest AURIX™ TC4x family of automotive microcontrollers now feature hardware support for the MathWorks Simulink® products.

Munich, Germany. Infineon Technologies AG unveiled the result of its collaboration with TSMC, the Arm v8-M architecture powered SLC26P. It is a security IC with a focus on high volume payment applications built on the future-proof 28 nm technology node. Previous technologies maturity, such as 90 nm, 65 nm, and 40 nm, are a factor for necessity in next-generation security applications.

Munich, Germany. Infineon Technologies AG partnered with 3D Time-of-Flight (ToF) specialist pmdtechnologies to release the IRS2975C imager sensor a performance update of the IRS2875C. The IRS2975C contains a half-quarter video graphics array (HQVGA) resolution of 240 x 180 pixels with a chip size of 18 mm ² for a 1/6" image circle.

Munich, Germany. Infineon Technologies AG released its EasyPACK 4B lead-type to its Easy power module series. Targeting photovoltaic string inverter applications (1500 V _DC solar string inverters), the series reaches 352 kW and a 40% improved increase in power output when juxtaposed with previous generation models.  The robust F3L600R10W4S7F_C22 comprises of advanced three-level NPC (ANPC) topology, 1200 V CoolSiC Schottky diode, 950 V TRENCHSTOP IGBT7 chip technology for up to 600 A.