Embedded Computing Design’s Road to embedded world will highlight a host of embedded suppliers who will be showcasing their latest products and technologies at embedded world, April 9th to 11th in Nuremberg, Germany. embedded world is the largest global gathering of its kind. Check back regularly to see where the Road to embedded world takes us.

The Embedded Computing Design editorial staff is pleased to present this year’s embedded world Best-in-Show nominees in the Microcontrollers, Microprocessors, & IP category:

Consumer security cameras are growing in popularity when it comes to smart home devices, whether they’re attached to porches, eaves, or as part of a doorbell.

Munich, Germany. Infineon Technologies released its Solid-State Isolators (iSSI) featuring drivers leveraging coreless transformer technology for faster and more efficient switching along with circuit protection functionalities that outperform those of optical-based Solid State Relays (SSR). The iSSI enables the driving of Infineon’s OptiMOS and CoolMOS, resulting in a 70 percent reduction in power dissipation compared to general solid-state relays using SCR (silicon-controlled rectifier) and Triac switches.

Have you ever heard of an isolator without a power supply? I hadn’t either, until now, sort of. That’s not exactly what Infineon is launching, but it’s close enough that I needed to have a conversation with Daniel Callen, Infineon’s Sr. Manager in the Power IC Group to understand exactly what the company is launching.

If your application is in solid-state relays, industrial automation (PLCs), or commercial HVAC controllers, this is a conversation you should hear. Check out this week’s Embedded Executives podcast.

Enabling wireless communication capabilities in electronic devices requires a system-on-chip (SoC) that supports seamless integration, reliability, flexibility, power and cost efficiency, and more. Wi-Fi and Bluetooth are two wireless connectivity solutions deployed in range of electronic devices with these features in mind.

Munich, Germany and Tokyo, Japan –Infineon and Honda Motor Co., Ltd. have signed a Memorandum of Understanding (MoU) to build a strategic collaboration and align future product and technology roadmaps.