Hello Embedded Engineers, Developers and Makers! Welcome to a special episode of In Case You Missed it: Embedded Insights, the weekly news show all about Embedded technologies and solutions from Embedded Computing Design, this week coming to you live from Taipei, Taiwan at COMPUTEX 2025!

Longsys(301308.SZ), a branded semiconductor enterprise, will exhibit at COMPUTEX 2025 from May 20 to 23 at the Taipei Nangang Exhibition Center, under the theme “Storage Meets AI.” As artificial intelligence continues to drive innovation across devices and infrastructure, Longsys will unveil a comprehensive portfolio of high-performance, high-capacity, and highly reliable storage solutions built for AI-era applications.

At the global industry show embedded world 2025 in Nuremburg, Germany earlier this month, there was lots of talk about how important memory has become to embedded systems. The drive toward implementing technological trends like AI and neural network computing is driving the necessity for reliable and robust memory and storage solutions.

Longsys introduced a 7.2mm × 7.2mm subsize eMMC, that delivers an innovative memory solution for enhancing the physical space of AI wearables. According to the press release, it is one of the smallest subsize eMMCs presently offered. 153 solder balls virtually cover the entirety of the panel.