Next-Gen Longsys eMMC Optimizes Space and Performance for AI Devices
January 29, 2025
News
Longsys introduced a 7.2mm × 7.2mm subsize eMMC, that delivers an innovative memory solution for enhancing the physical space of AI wearables. According to the press release, it is one of the smallest subsize eMMCs presently offered. 153 solder balls virtually cover the entirety of the panel.
The surface area is reduced by approximately 65% when juxtaposed with the standard 11.5mm × 13mm eMMC. The thickness of the eMMC is 0.8mm and weighs approximately 0.1g compared to the standard 0.3g eMMC.
Included firmware guarantees fast device boot-up, seamless AI application performance, and efficient data processing. To lower energy use for optimal battery life, support for intelligent sleep and dynamic frequency scaling is available.
With high capacities of 64GB and 128GB, the eMMC is ideal for AI-enhanced wearables, including smart glasses, watches, and earphones.
For more information, visit longsys.com/.
Chad Cox is the Production Editor at Embedded Computing Design. His responsibilities are centered around content creation, writing and editing, and article research and development. Chad covers industry news and events and is known to interact with various industrial leaders via on-premise visits and online interviews. He is responsible for the digital footprint and dissemination of news via social media posts, advertising creation and the production of newsletters including the Embedded Computing Design’s Daily.
He is well versed in many facets of industrial computing including Edge AI, IoT, Processing, Security, Open Source, and more.
Chad graduated from the University of Cincinnati with a B.A. in Cultural and Analytical Literature and holds a master’s in education.
