Sealevel Systems

Articles related to Sealevel Systems
Processing

embedded world 2024 Best in Show Nominees: Computer Boards, Systems, Components, & Peripherals - Story

April 01, 2024

The Embedded Computing Design editorial staff is pleased to present this year’s embedded world Best-in-Show nominees in the Computer Boards, Systems, Components, & Peripherals category:

Industrial

Connect to the Embedded World with Sealevel at embedded world 2024 - News

March 15, 2024

During April 9-11, Sealevel Systems, Inc. will have an exhibition at embedded world 2024 (Hall 3, Stand 141) with a motto “Connecting the Embedded Community” focusing on the future of hardware design, M2M communication, vision, and edge technology.

Open Source

Embedded Executive: Customize Your COM Express Design, Sealevel Systems - Podcast

February 07, 2024

COM Express has been around for at least a decade. While many people think of it as a standard architecture (it is), it can be customized in lots of different ways. To understand how a standard can be made custom while remaining standard, I spoke to Earle Foster, a Senior Vice President, Sealevel Systems in this week’s Embedded Executives podcast. It’s actually easier than you might think.

Processing

Best in Show Nominee: Sealevel Systems - 12009 COM Express Compact Type 6 Evaluation Board  - Product

March 10, 2023

Designed to meet a wide variety of application needs, the 12009 evaluation board supplies a diverse I/O mix and robust processing support. Standard I/O includes Gigabit Ethernet, USB 3.0, USB 2.0, GPIO, RS-232, and Mini DisplayPort. The carrier board is designed for the congatec® conga-TC370 COM Express family, with support for 8th generation Intel® Core™ processors, up to 64 GB DDR4 RAM, and TPM 2.0 support. The 12009 features a wide operating temperature range of 0ºC to 70ºC and is powered via a locking, four-position Molex Micro-Fit connector. 

Processing

Product of the Week: Sealevel’s COM Express Compact Type 6 Evaluation Board - Story

October 17, 2022

If you’re looking to accelerate the development of your embedded applications with an off-the-shelf solution that will enable fast deployment and is designed for rugged, compact, and functional operation, you might want to choose the highly integrated, scalable, and widely used computer-on-module (COM) standard capable of supporting small-scale to large-scale applications.

Industrial

Sealevel’s New Leadership Excels at SWaP Engineering and Functional Density - Press Release

June 02, 2021

LIBERTY, SC, USA May 24, 2021 – Sealevel Systems, Inc., has promoted Jeff Baldwin to Director of Engineering.