As multi-die systems grow more prevalent in the semiconductor space, the Universal Chiplet Interconnect Express (UCIe) specification is taking center stage.

BEAVERTON, OREGON. Tektronix, Inc., in collaboration with Anritsu Corporation, announced a solution that enables testing of PCIe® 6.0 (Base) receivers and transmitters and addresses the demands of next-generation high performance systems. With this release, Tektronix provides a cohesive PCIe 6.0 transmitter and receiver test solution that delivers faster test times, higher-quality measurements, and an intuitive user interface.

There hasn’t been another time in recent memory where semiconductors have become as critical to fueling the electronics industry’s economic framework. This has become abundantly clear with the global chip shortage, which continues to distress industry sectors from automotive to consumer electronics.

With growing compute requirements and tighter design schedules, semiconductor companies are constantly being tested to deliver both complex functionality and exceptional performance very quickly. Irrespective of where the customer is in their cloud journey, designers need to drive greater productivity and efficiency for complex chip design flows.

With increasing SoC and system complexity, shrinking market windows, and growing engineering resource challenges, anything that can improve chip design productivity—not to mention the associated chip quality—can give you a significant edge over your competitors.

Synopsys announced a critical expansion of its EDA data analytics portfolio with the introduction of Synopsys DesignDash design optimization solution.