Embedded Computing Design

Continental and Amazon Web Services (AWS) will be working together going forward within the scope of a new development cooperation.

AImotive and Nextchip are demonstrating NPU efficiency for demanding automotive vision NN workloads.

DSP Concepts announced the fully optimized Audio Weaver library available for the Cadence Tensilica HiFi 5 DSP with general release by the end of Q2 2021.

Infineon Technologies AG announced the launch of the XENSIV IM67D130A.

Klika Tech and AWS during embedded world 2021 demonstrated a development kit for deploying predictive maintenance in Industrial Internet of Things ecosystems (IIoT).

Percepio and Lauterbach announced their cooperation to achieve faster debugging through closer integration between Percepio Tracealyzer and Lauterbach’s series of TRACE32 tracing tools.

Renesas Electronics expanded its ongoing work with Qualcomm Technologies to include 30W wireless charging capabilities for mid-range smartphones powered by the latest Qualcomm Snapdragon 780G 5G Mobile Platform.

The new K88 option for R&S RTO and R&S RTP oscilloscopes from Rohde & Schwarz enables compliance testing on the next evolution of the automotive Ethernet standard.

Where are we on the road to Level 5 autonomous vehicles (AVs)? We’ve all seen fully autonomous Ubers and test vehicles driving around.

Litemax announced the AMIX-CML0, the latest addition to its family of Mini-ITX form factor embedded system boards. 

Electric vehicle charging design consultancy Versinetic announced its partnership with international software provider Saascharge.

VadaTech announced the AMC539 based on the Altera Arria-10™ GX1150 FPGA in F1517 package and is compliant to AMC.1, AMC.2, AMC.3, and/or AMC.4 specifications.

TQ Systems has introduced the TQMxE40M, a new generation of its COM Express Mini Modules.

Newark, an Avnet Company, now offers the new NGU series of source measure units (SMU) from Rohde & Schwarz, one of the world's manufacturers of electronic test and measurement equipment.

Vecow announced the latest AI Computing System MIG-1000.

The new UG65 LoRaWAN gateway from ICP Germany features 8 simultaneous channels, more than 2000 LoRaWAN nodes, and a high-performance quad-core processor.

Siemens introduced PCBflow, a cloud-based software solution designed to bridge the gap between the electronics design and manufacturing ecosystems.

Lattice Semiconductor Corporation expanded its Lattice Crosslink-NX family with new FPGAs specified for automotive applications such as advanced driver assistance systems (ADAS) and in-vehicle infotainment (IVI) systems.

A fire at the Renesas Electronics semiconductor fabrication plant in Hitachinaka, Japan, on Monday, March 19th burned approximately 600 meters, roughly 5 percent of the building’s clean room area.

Trusted Platform Modules (TPM) enable secured remote software updates, disc encryption, and user authentication.