Infineon Introduces Industry’s First AEC-Q103 Qualified XENSIV MEMS Microphone for Automotive Applications

By Tiera Oliver

Associate Editor

Embedded Computing Design

April 19, 2021

News

Infineon Introduces Industry’s First AEC-Q103 Qualified XENSIV MEMS Microphone for Automotive Applications

Infineon Technologies AG announced the launch of the XENSIV IM67D130A.

This new device is designed to address the need for high performance, low-noise MEMS microphones for automotive applications. According to the company, the XENSIV IM67D130A is the first microphone in the market to be qualified for automotive applications, designed to help simplify the design-in efforts for the industry and reduce the risk of qualification fails.

The microphone has an increased operating temperature range from -40°C to +105°C to enable various use cases in harsh automotive environments. The high acoustic overload point (AOP) of 130 dB SPL allows the microphone to capture distortion-free audio signals in loud environments. Because of that, it can be placed inside or outside of the vehicle. IM67D130A is ideal for in-cabin applications such as hands-free systems, emergency calls, in-cabin communication and active noise cancellation (ANC). The microphone is also suited for exterior applications such as siren or road condition detection. These features enable the use of sound as a complementary sensor for advanced driver assistance systems and predictive maintenance.

The high signal-to-noise ratio (SNR) of 67 dB combined with a low distortion level leads to suitable speech quality and speech intelligence for applications based on speech recognition. Additionally, the microphones have tight sensitivity matching allowing optimized beamforming algorithms for multi-microphone arrays. The XENSIV MEMS microphone IM67D130A is fully qualified for the AEC-Q103-003 standard for automotive applications.

The XENSIV MEMS microphone IM67D130A can be ordered now in a PG-LLGA-5-4 package.

For more information, visit: www.infineon.com/mems-automotive.

Tiera Oliver, Associate Editor for Embedded Computing Design, is responsible for web content edits, product news, and constructing stories. She also assists with newsletter updates as well as contributing and editing content for ECD podcasts and the ECD YouTube channel. Before working at ECD, Tiera graduated from Northern Arizona University where she received her B.S. in journalism and political science and worked as a news reporter for the university’s student led newspaper, The Lumberjack.

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