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Miniature Power Supply: Infineon's First Flip-Chip Production Designed for Automotive Applications - NewsJanuary 28, 2020
The higher power density enables a significantly smaller footprint than conventional package technologies.
Advanced Embedded Systems Drive Next-Generation Automotive Applications - StoryJanuary 27, 2020
Highly-integrated processors are needed to support the advanced functionalities a next-generation vehicle must deliver
Infineon and Rompower to Advance USB-PD Chargers - NewsJanuary 09, 2020
USB-PD is made possible by the universal USB-C connector, and the next development stage will be permanently installed USB-PD wall outlets.
Infineon Claims Smallest 3D Image Sensor for Face Authentication - NewsJanuary 07, 2020
The REAL3 single-chip solution measures 4.4 x 5.1 mm, and offers high-resolution data with low power consumption.
Infineon's EconoDUAL 3 with TRENCHSTOP IGBT7 Achieves a 900A Power Rating - NewsJanuary 02, 2020
The power modules feature a maximum allowed overload junction temperature of 175?C.
Bernd Hops to take over as Head of Corporate Communications at Infineon - Eletter ProductNovember 15, 2019
From January 2020, Bernd Hops (46), currently Head of External Communications, will take over as Head of Communications and Public Authorities & Associations at Infineon Technologies AG.
New technology for mature applications: CoolSiC MOSFET evaluation board for motor drives up to 7.5 kW - ProductNovember 15, 2019
Silicon carbide (SiC) is en route to mainstream for applications like photovoltaic and uninterruptable power supplies.