The AIROC CYW20829 Bluetooth LE SoC is a Bluetooth 5.3 core spec-compliant device with a combination of low power and high performance, designed to support the entire spectrum of Bluetooth Low Energy (LE) use cases for home automation, sensors, lighting, Bluetooth Mesh, remote controls, and any other Bluetooth LE-connected IoT application.

At CES 2022, Infineon Technologies AG launched a new generation of its AURIX microcontroller family (MCU).

Infineon Technologies released the EiceDRIVER 1EDN71x6G HS 200V single-channel gate driver ICs family.

When NASA decided they wanted to design and launch the James Webb Space Telescope (JWST), IR HiRel was called on to supply mission-critical radiation-hardened (rad hard) components for the JWST.

Successful IoT solutions rely on secured connectivity from any device and any location, and Infineon demonstrations will showcase how the company creates trust in the digital world that allows users, enterprises and organizations to unleash the full potential of the IoT.

Infineon Technologies AG launched the company’s fifth-generation CAPSENSE™ capacitive and inductive touch sensing human-machine interface (HMI) technology. The enhanced HMI enables advanced solutions like proximity sensing with improved detection range, gesture detection and directivity, and hover detection for tomorrow’s advanced touchscreens.

Infineon Technologies AG announced the launch of the new AIROC Bluetooth LE and 802.15.4 family to help companies bring low-power, high-performing Matter products to market.