The boom coming from AI is requiring data centers to be built as fast as we can build them. To that end, there is a lot of discussion about the power that’s needed to drive these data centers. What there’s not a lot of discussion about are the interconnects that are used within these power-hungry computing camps. And that’s the specialty of Point2 Technology, a fairly new company that boasts ultra-low power interconnect solutions. 

To understand how the company’s technology works, I spoke to Sean Park, Point2’s President, CEO, and Founder, on this week’s Embedded Executives podcast.

Hello Embedded Engineers, Developers and Makers! Welcome to In Case You Missed it: Embedded Insights, the weekly news show all about Embedded technologies and solutions from Embedded Computing Design.

Point2 Technology and Foxconn Interconnect Technology (FIT) have signed a Memorandum of Understanding (MOU) to promote the standardization of next-generation Active RF Cable (ARC) and Near Pluggable e-Tube (NPE) solutions. The agreement brings an innovative class of cable interconnects to support the growing need for higher-performance interconnects within hyperscale data centers.

San Jose, California. Point2 Technology introduced the Point2 P1B12,1 its innovative Smart Retimer system-on-chip (SoC) for AEC applications in hyperscale AI/ML datacenters. It incorporates eight-unidirectional SerDes channels with smart Clock Data Recovery (CDR)/Retimer operations that support 112G PAM4 and 56G NRZ data rates. The Point2 P1B121 is designed for low-power and low-latency operations in 800 gigabit (800G) and 1.6 Terabit (1.6T) Active Electrical Cables (AECs). At 3 nanoseconds (3ns), the P1B121 chip latency is 20X lower than standard DSP-based PAM4 Retimers.


 

Next-gen AECs reduce energy consumption and operating expenses while supporting faster data center performance.