congatec to Showcase First COM-HPC Mini at ew '23
February 09, 2023
News
San Diego, CA. congatec will be highlighting its comprehensive COM-HPC ecosystem in hall 3 booth 241 during embedded world 2023. On display will be the COM-HPC Server-on-Modules and ultra-compact COM-HPC Client-on-Modules that around the size of a credit card. The series can easily migrate to the new PICMG standard devoid of significant modification of the internal system and housing.
congatec’s booth will demonstrate the first samples of COM-HPC Mini designs launching now with the final PICMG ratification of the specification. The module is equipped with the 13th Gen Intel Core processors (codename Raptor Lake) for users needing high performing edge computing.
The ratification enables designers to create environments with capable data throughput, I/O bandwidth, and performance that cannot be accomplished with COM Express. COM Express 3.1 delivers security in investment in OEM designs with data throughput by way of PCIe Gen 4. The mini form factor accommodates ultra-compact high-performance designs such as DIN rail PCs, rugged handhelds, and tablets.
For more information, visit congatec.com.
Chad Cox is the Production Editor at Embedded Computing Design. His responsibilities are centered around content creation, writing and editing, and article research and development. Chad covers industry news and events and is known to interact with various industrial leaders via on-premise visits and online interviews. He is responsible for the digital footprint and dissemination of news via social media posts, advertising creation and the production of newsletters including the Embedded Computing Design’s Daily.
He is well versed in many facets of industrial computing including Edge AI, IoT, Processing, Security, Open Source, and more.
Chad graduated from the University of Cincinnati with a B.A. in Cultural and Analytical Literature and holds a master’s in education.
