BIWIN Storage Technology Co., Ltd. (BIWIN) will exhibit its innovative Mini SSD at embedded world 2025 located at Booth 1-140. Attendees will experience firsthand how BIWIN is pushing the boundaries of storage technology with the Mini SSD leading the way.  It delivers high-performance and compact solutions for mobile devices, edge computing, and beyond.

At this year’s embedded world, BIWIN (Booth 1-140) will showcase its range of solutions and specifically highlight two standout products to that showcase BIWIN’s abilities in addressing various embedded storage markets.

In a recent release, Biwin has introduced its next-generation Mini SSD, a new form factor designed to open new opportunities in data storage thanks to its compact design, high performance, and reliability.

At Flash Memory Summit 2023 Booth 619, BIWIN Storage Technology Co., Ltd. will show a wide range of embedded memory and industrial solutions designed to meet the increased global demand for memory and storage needs.

With up to 1TB capacity, the BIWIN PCIe Gen4 BGA SSD EP400 comes with the high-speed PCIe 4.0 x 2 to deliver up to 3500 MB/s read and 3300 MB/s write — with dimensions of just 11.5 mm (L) x 13 (W) mm. The storage solution is known for great performance, large capacities, smaller size, lower power consumption, and lower Total Cost of Ownership (TCO) — all of which contribute to a better experience with mobile applications.

The need for storage is only going to grow with data and more data being used for the consumer, corporate, and industrial segments. BIWIN Storage Technology CO., Ltd. will be highlighting its reliable flash storage at embedded worl 2023.  BIWIN is known for its independent development capabilities in hardware, software, firmware and storage algorithms.

At Flash Memory Summit 2022 Booth 619, BIWIN Storage Technology Co., Ltd. showed its wide-ranging embedded memory and industrial solutions portfolio designed to meet the increased demand for complex memory and storage needs.