Visitors to BIWIN’s booth (#1-140) at embedded world Germany will see the ePoP5X that combines LPDDR5X DRAM and eMMC storage into a single package, all facilitated by BIWIN's innovative multi-die stacking, ultra-thin die processing, and heterogeneous multi-chip integration technologies.

During its stay at embedded world Germany 2026, BIWIN Storage Technology Co., Ltd. (BIWIN) will be in Booth 1-140 demonstrating its BIWIN TAU208 UFS 3.1 automotive-grade storage designed for performance and reliability in harsh environments.

BIWIN Storage Technology Co., Ltd. will attend embedded world North America where it will exhibit its latest memory and storage innovations including solutions engineered for embedded, automotive, and industrial applications. Visitors to Booth 2010 will have a chance to see the BIWIN ePoP LPDDR4X, BIWIN LPDDR5X, BIWIN eMMC 5.1, and BIWIN Mini SSD, all designed for high efficiency and reliability.

BIWIN Storage Technology Co., Ltd. (BIWIN) will exhibit its innovative Mini SSD at embedded world 2025 located at Booth 1-140. Attendees will experience firsthand how BIWIN is pushing the boundaries of storage technology with the Mini SSD leading the way.  It delivers high-performance and compact solutions for mobile devices, edge computing, and beyond.

At this year’s embedded world, BIWIN (Booth 1-140) will showcase its range of solutions and specifically highlight two standout products to that showcase BIWIN’s abilities in addressing various embedded storage markets.

In a recent release, Biwin has introduced its next-generation Mini SSD, a new form factor designed to open new opportunities in data storage thanks to its compact design, high performance, and reliability.

At Flash Memory Summit 2023 Booth 619, BIWIN Storage Technology Co., Ltd. will show a wide range of embedded memory and industrial solutions designed to meet the increased global demand for memory and storage needs.