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Industrial
Whitepaper COM-HPC®: Taking Standardized COMs to the Next Level - Eletter Product
March 12, 2021The long-established COM Express® standard for Computer-on-Modules (COM) has recently been joined by COM-HPC®, a new High Performance Computing standard from the PCI Industrial Computer Manufacturers Group (PICMG®).
How the SMARC Module 2.1 revision responds to the latest IoT- and AI-driven demands on embedded computing solutions - Whitepaper
July 10, 2020Learn more about the new SMARC™ 2.1 specification, new key features and changes. Get a detailed comparison between the SMARC™ 2.0 module and the SMARC™ 2.1 module and find out more about special use..
Industrial
Kontron to Launch D3713-V/R mITX Motherboard at embedded world 2020 - News
February 04, 2020Kontron will present their D3713-V/R mITX industrial motherboard, based on the AMD Ryzen Embedded V1000 and R1000 line, at this year's embedded world exhibition.
Thermal simulation optimizes cooling in high-performance systems - Story
May 01, 2008New technologies like Computational Fluid Dynamics (CFD) software are making it possible for engineers to effectively deliver thermal management exper...