Embedded Computing Design

When I first heard about this, it sounded like a little smoke and mirrors, to be able to work the latest buzzwords into the product’s announcement. But a deeper dive reveals that ML implementation is really taking place here.

The Eclipse Foundation recently conducted a survey that focuses on IoT and Edge solutions.

Firmware testing is often performed in a vacuum, aka a perfect environment in a lab. When taken out to the real world, the product may or may not perform as expected due to a variety of factors.

Security is one of the foremost topics in the embedded space today. In a recent conversation with Patrick Carrier, the Regional Manager for IoT and Cloud Security at Infineon Technologies, he had a different spin on security.

Develop an ASIC for less than $10,000? I didn’t believe it either. But according to Jeff DiCorpo, a Senior VP at efabless, not only is it possible, but people are doing it with his company’s tools. Learn how to generate your own design on this week’s Embedded Executives podcast.

COM-HPC was officially ratified about six months ago. Embedded Computing Design has done a nice job covering the spec and many of the products that have come out of the spec (some before ratification and many after). We also posted a series of videos (called COM-HPC Academy) with some of the influential members of PICMG, the standards body behind the spec.

LoRaWAN wants to invade your home. Its backers think that it’s perfect for many smart home applications. However, don’t we already have one — or two or three —wireless networks that are “perfect” for the home, namely Bluetooth and WiFi?
 

Scottsdale, AZ – June 22 2021 – Prysm Media Group, one of the foremost B2B trade exhibitions for over 20 years, today announced a partnership between its Embedded Technology Convention and OpenSystems Media’s Embedded Computing Design, the leading content provider for embedded engineers and developers. Under the terms of the agreement, Embedded Computing Design will be the official content provider for the event.

Power Integrations has upped the game in the switching power-supply space with the release of its LinkSwitch-TNZ ICs. The devices combine offline power conversion, lossless zero-cross detection and, optionally, X-capacitor discharge functions, all in a compact SO-8C package. The parts can be used for non-isolated buck and buck-boost power supplies with an output current of up to 575 mA and can provide up to 12 W output for universal-input isolated flyback designs. These are specs that are suited for smart home and appliance applications.

Lower power and higher bandwidth are the key characteristics needed for Edge-based processing. And those are the principles that Lattice’s CertusPro-NX general-purpose FPGA family are built upon. These devices increase the logic density over what was previously offered to up to 100k logic cells.