Alliance Memory Announced 5GB and 10GB 3D pSLC eMMCs

By Chad Cox

Production Editor

Embedded Computing Design

July 10, 2024

News

Image Credit: Alliance Memory

Kirkland, Washington. Alliance Memory announced the release of its 5GB ASFC5G31P3-51BIN and 10GB ASFC10G31P3-51BIN industrial-grade 3D pSLC embedded multi-media card (eMMC) integrating reliable 3D pSLC NAND flash memory with an eMMC controller and flash transition layer (FTL) management software in a 11.5 mm by 13 mm by 1 mm 153-ball FBGA form.

The solutions are compliant with JEDEC eMMC v5.1 industry standard and delivers boot operation, replay protected memory block (RPMB), device health report, field firmware updates, power-off notification, enhanced strobe features, write leveling, high-priority interrupt (HPI), secure trim/erase, and high-speed HS200 and HS400 modes. They are backwards-compatible with eMMC v4.5 and v5.0.

Operating temperatures range from -40°C to +85°C and offer programmable bus widths of x1, x4, and x8. The NAND memory, with internal LDO, can be powered with a 3V supply voltage, while the controller can be powered by 1.8V or 3V dual supply voltages. The FTL software provides wear levelling and bad block management.

A 32MB boot partition supports applications in smart watches, tablets, digital TVs, set-top boxes, VR and AR headsets, digital cameras, CCTV, infotainment, surveillance, automation, and point-of-sale systems.

"With the introduction of these new enhanced-mode 3D pSLC parts, we've further solidified our position as a leading provider of eMMC technology," said David Bagby, president and CEO, Alliance Memory. "For our customers, these lower-density devices offer higher reliability and endurance than MLC and TLC NAND solutions while delivering the same ease of integration and space savings."

For more information, visit alliancememory.com/.

Chad Cox is the Production Editor at Embedded Computing Design. His responsibilities are centered around content creation, writing and editing, and article research and development. Chad covers industry news and events and is known to interact with various industrial leaders via on-premise visits and online interviews. He is responsible for the digital footprint and dissemination of news via social media posts, advertising creation and the production of newsletters including the Embedded Computing Design’s Daily.

He is well versed in many facets of industrial computing including Edge AI, IoT, Processing, Security, Open Source, and more.

Chad graduated from the University of Cincinnati with a B.A. in Cultural and Analytical Literature and holds a master’s in education.

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