Munich, Germany. Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is taking a major step forward in the wireless human input device (HID) space. The company just announced that its AIROC™ CYW20829 Bluetooth® LE microcontroller (MCU) and SDK have been verified under Intel’s “Engineered for Intel® Evo™” laptop accessory program, making it the first Bluetooth HID solution to earn that distinction. That’s a big deal.

Ditch the dongle with Engineered for Intel Evo, a verified program that meets Intel’s strict direct-to-host wireless connection requirements. Powered by Infineon’s CYW20829, the first program co-engineered with Intel at the chip and SDK level, physical security is enhanced while meeting CRA and RED certifications. This innovation brings significant advancement to the wireless connectivity space, streamlining development and elevating the user experience.

With the rising popularity of eBikes and eScooters, having wireless access to vital information, such as speed and map directions, is key to ensuring rider safety. With so many applications to choose from, this demo will focus on 20829’s peripheral support for automotive industry standards, such as CAN and LIN, while highlighting its versatility both as an MCU and Bluetooth LE chip.

In every industry, automation via machine learning or AI, or both, is the trend of the decade, so far. When paired with robotics, sensing, switching, and controls, the power of industrial automation to revolutionize manufacturing, warehousing, supply chain, mining, O&G, and almost any other industrial vertical is already showing.

Want to get started with the latest Bluetooth 5.4 supported Bluetooth LE MCU? View everything you need to get started with the AIROC™️ CYW20829 Bluetooth®️ LE MCU Evaluation Kit here.

Although there is always a lot of talk about Human-Machine Interfaces, or HMI, whenever engineers are designing a new system, the most common way that people encounter HMI is at home, usually in front of their laptop.

PC accessory architecture for better HMI is rapidly evolving thanks to improved technology, emerging specifications, stricter security regulations, and enhanced sensor capabilities.

TSMC recently announced its exit from the GaN space. Well, maybe “announced” is the wrong word, but they did let customers know that they will not be producing GaN devices going forward. 

Details are still coming out, so we don’t know exactly when that stoppage will occur. So what does that mean for TSMC partners who relied on them to produce their products? 

To understand what that means, I spoke to Johannes Schoiswohl, the Senior Vice President and General Manager of Infineon’s GaN Business Line. Infineon may have an easier time than others making this transition, but it’s an interesting time nonetheless. Check out this week’s Embedded Executives podcast to learn more.