Bluetooth has become a ubiquitous part of everyday life. It’s powering high-end headphones and automotive infotainment systems and everything in between.

One arena where Bluetooth has really been seeing some serious growth and development is in remote control and management. The signal is secure and strong over medium ranges, making it ideal for remote control applications.

Infineon Technologies AG launched the third generation of the XENSIV™ 3D magnetic Hall-effect sensor family, comprising three product series: TLE493D-W3B6-Bx, TLE493D-P3B6, and TLE493D-P3I8.

Listen to our application engineer and his team unveil our Bluetooth LE Long Range Capabilities and the outcomes of our extensive testing on the CYW20829 device.

In smart buildings, smart homes, or any other IoT-enabled, connected, and (crucially) lit smart infrastructure, the lighting is often the first and best place to start. Smart lighting can result in greater energy efficiency at a lower cost than almost any other initiative. This ROI, delivered early and quickly, has made lighting a smart and strategic beginning to intelligent design for years.

When I first began directly interacting with my devices, I felt a direct connection to the devices. After a while, they “understood” me, almost knowing what actions I would take before I took them. It’s that direct connection that today’s human interface devices (HIDs) actually provide. And it’s not just a “feeling” anymore. Now, it’s reality. The HIDs serve as a bridge between us and our digital world, turning our hands, gestures, and movements into something a computer can react to instantly.

In our world of embedded systems and wireless connectivity, there’s no shortage of synthetic tests and perfectly controlled lab scenarios. But as any engineer worth their oscilloscope knows, the real challenge lies in the real world. It’s the real world where unexpected conditions arise, and where products earn their stripes, or show their flaws. At Infineon, we’ve always leaned into practical evaluation, and our latest deep dive into Bluetooth^® Low Energy (LE) throughput with the AIROC™ CYW20829 Bluetooth LE MCU follows that same hands-on philosophy.

Centralized compute platforms are steadily replacing traditional domain-based E/E architectures in software-defined vehicles (SDVs). At the core of these platforms are high-performance system-on-chips (SoCs) that manage increasingly complex vehicle functions—from advanced driver-assistance systems (ADAS) to infotainment.