STMicroelectronics, Fieldscale Bring Touch Controls to STM32-Based Devices

By Rich Nass

Contributing Editor

Embedded Computing Design

January 27, 2020

News

STMicroelectronics, Fieldscale Bring Touch Controls to STM32-Based Devices

STMicroelectronics and Fieldscale, a provider of simulation software, have announced a partnership to simplify the development process for adding touch interfaces to embedded systems.

STMicroelectronics and Fieldscale, a provider of simulation software, have announced a partnership to simplify the development process for adding touch interfaces to embedded systems. Their work adds the technology to smart devices containing ST’s STM32 microcontrollers (MCUs). Specifically, support is included on ST’s Arm Cortex-based 32-bit MCUs for Fieldscale’s Sense development platform.

Fieldscale Sense is an end-to-end solution for the design, schematic capture, and system-level simulation of capacitive touch sensors. The latest version lets STM32 users quickly design the touch sensor and PCB layout for virtual system simulation purposes.

Touch-sensitive controls are becoming more popular, especially for smart consumer devices as well as industrial platforms. However, developing such systems can be a challenge for a designer. By laying the groundwork for the designer, the process is greatly simplified, and can be done with cloud-based tools that are already familiar.

Before committing to building physical prototypes, with developers can design or import capacitive touch sensor layout as a standard DXF or Gerber file(s). They can also create 3D models of the sensor by clicking their way through material and connections assignment. Fieldscale Sense automatically applies the appropriate boundary conditions.

Fieldscale Sense is available now as an online service and comes with a flexible pricing model based on specific needs.

Rich Nass is a regular contributor to Embedded Computing Design. He has appeared on more than 500 episodes of the popular Embedded Executive podcast series, and is a regular contributor to the Embedded Insiders podcast.

Rich has been in the engineering OEM industry for more than 35 years, and is a recognized expert in the areas of embedded computing, Edge AI, industrial computing, the IoT, and cyber-resiliency and safety and security issues. He writes and speaks regularly on these topics and more.

Rich is currently the Liaison to Industry for the Embedded World North America Exhibition and Conference, and has held similar positions with the global Embedded World Conference and Exhibition.

Previously, Rich was the Brand Director for UBM’s award-winning Design News property. Prior to that, he led the content team for UBM Canon’s Medical Devices Group, as well all custom properties and events.  In prior stints, he led the Content Team at EE Times, handling the Embedded and Custom groups and the TechOnline DesignLine network of design engineering web sites.

Nass holds a BSEE degree from the New Jersey Institute of Technology.

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