AMD Ryzen Based congatec COM Express Module for the Industrial Temperature Range

By Tiera Oliver

Associate Editor

Embedded Computing Design

April 30, 2020

News

The conga-TR4 COM Express Type 6 Computer-on-Modules can be ordered in the listed variants, with standard temperature range configurations also available.

Congatec, a vendor of embedded computing technology, introduces its new conga-TR4 COM Express Type 6 module with AMD Ryzen Embedded V1000 Series processors for the industrial temperature range of -40°C to +85°C. 

The conga-TR4 is available with optional burn-in & cold-soak stress screening service. According to the company, the graphics and compute workloads benefit from the modules’ 4 cores, 8 threads, and 8 GPU compute units delivering the processing throughput of AMD’s Zen microarchitecture in an ultra-rugged shape. The thermal design power (TDP) is scalable from 12W to 25W enabling 4k UHD system designs with passive cooling only. 

The performance of the new conga-TR4 COM Express Type 6 module depends on the environmental conditions and is specified with 1.6 GHz to 2.8 GHz turbo boost in the sub-zero temperature range and 2.0 GHz to a maximum of 3.6 GHz in the positive temperature range. The performance of the ultra-rugged conga-TR4 Computer-on-Modules has been made available in a real-time capable design and also includes real-time hypervisor support by Real-Time Systems for virtual machine deployments and workload consolidation in edge computing scenarios.

The new conga-TR4 high-performance module with COM Express Type 6 pinout supports up to 32GB energy-efficient and fast dual-channel DDR4 memory with up to 3200 MT/s and optional ECC for maximum data security. The integrated AMD Radeon Vega graphics with 8 compute units marks the cutting edge of embedded graphics. It supports up to four independent displays with up to 4k UHD resolution and 10-bit HDR, as well as DirectX 12 and OpenGL 4.4 for 3D graphics. The integrated video engine enables hardware-accelerated streaming of HEVC (H.265) video in both directions. With HSA and OpenCL 2.0 support, deep learning workloads can be assigned to the GPU. According to the company, in safety-critical applications, the integrated AMD Secure Processor helps with hardware-accelerated RSA, SHA, and AES encryption and decryption.

The new conga-TR4 allows a complete USB-C implementation on the carrier board including USB 3.1 Gen 2 with 10 Gbit/s, Power Delivery, and DisplayPort 1.4, for example to connect external touchscreens with a single cable. Further performance-oriented interfaces include 1x PEG 3.0 x8, 4x PCIe Gen 3 and 4x PCIe Gen 2, 3x USB 3.1 Gen 2, 1x USB 3.1 Gen 1, 8x USB 2.0, 2x SATA Gen 3, and 1x Gbit Ethernet. I/Os for SD, SPI, LPC, I²C as well as 2x legacy UART from the CPU and High Definition Audio round off the range of interfaces. The supported operating systems include Linux, Yocto 2.0, and Microsoft Windows 10, or optionally Windows 7.

The conga-TR4 COM Express Type 6 Computer-on-Modules can be ordered in the following variants, with standard temperature range configurations also available:

More information, please visit: http://www.congatec.com/en/products/com-express-type6/conga-tr4.html

Tiera Oliver, Associate Editor for Embedded Computing Design, is responsible for web content edits, product news, and constructing stories. She also assists with newsletter updates as well as contributing and editing content for ECD podcasts and the ECD YouTube channel. Before working at ECD, Tiera graduated from Northern Arizona University where she received her B.S. in journalism and political science and worked as a news reporter for the university’s student led newspaper, The Lumberjack.

More from Tiera