POLYRACK to present case and system solutions at embedded world 2018
At embedded world 2018, POLYRACK will present a range of customizable case and system solutions for the embedded market, particularly for industrial environments.
At embedded world 2018, POLYRACK will present a range of customizable case and system solutions for the embedded market, particularly for industrial environments.
For one, it will be showcasing its PanelPC 2-series, which offers panel PC solutions that satisfy the protection class IP54 and are available in sizes from 10.1” to 21.5”, in different materials such as milled aluminum or sheet metal bending solutions, and with resistive single-touch or multi-touch capable touchscreens (PCAP) in different glass thicknesses. Solutions can be further customized with customer specific printing and anti-fingerprint coating and, to use the advantages of different materials, other technologies are available for customers to realize individual requirements in materials, such as plastics and castings – also in a material combination mix.
They will also present Small Form Factor with EmbedTEC, a customizable aluminum table top case that is appropriate for small form factors such as embedded NUC (eNUC), pico-ITX (pITX, 2.5“), SMARC, QSeven and SBCs, and the Raspberry Pi. It comes with a changeable front I/OShield and an aluminum cover for heat dissipation that can be replaced by a heat sink or other cooling methods for improved performance. You can also find supporting enclosure series like SmarTEC. All solutions are characterized by matching interaction of mechanics, plastics, electronics and surface finish – fine-tuned to customer requirements.
These solutions and more can be found February 27 to March 1, 2018 at embedded world in Nuremberg, Germany in Hall 3, Booth 557.
