Infineon Releases New PDM MEMS Microphone Solution

By Chad Cox

Production Editor

Embedded Computing Design

February 13, 2023

News

Infineon Releases New PDM MEMS Microphone Solution

Munich, Germany. Infineon Technologies has designed its PDM (pulse density modulation) MEMS microphone solutions to deliver the essential building blocks of MEMS and ASIC technologies. Adding to its previous MEMS technology, Infineon released its ultra-low power digital microphone, the IM69D12, to its XENSIV MEMS microphone series.

Based on Infineon’s latest Sealed Dual Membrane MEMS technology, the microphone enables high ingress protection (IP57) at the microphone level, and facilitates clear audio without a major concern for battery life with a consumption rate of 520 μA. It can switch to and from different energy and operating profiles without any audible interference that makes it difficult to hear.

The IM69D12 is perfect for the following applications:

  • True wireless earbuds
  • Overear headsets
  • Hearing enhancement devices
  • Wearables
  • Smartphones
  • IoT devices

For more information, visit www.infineon.com/mems.

Chad Cox is the Production Editor at Embedded Computing Design. His responsibilities are centered around content creation, writing and editing, and article research and development. Chad covers industry news and events and is known to interact with various industrial leaders via on-premise visits and online interviews. He is responsible for the digital footprint and dissemination of news via social media posts, advertising creation and the production of newsletters including the Embedded Computing Design’s Daily.

He is well versed in many facets of industrial computing including Edge AI, IoT, Processing, Security, Open Source, and more.

Chad graduated from the University of Cincinnati with a B.A. in Cultural and Analytical Literature and holds a master’s in education.

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